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Array substrate, manufacturing method therefor, and display device

A technology for array substrates and manufacturing methods, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as thinning and sagging of adhesive materials, disconnection, deformation and expansion of adhesive layers, etc., to achieve large contact area and improve support performance, improve the effect of pressure resistance

Active Publication Date: 2017-09-12
BOE TECH GRP CO LTD
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  • Abstract
  • Description
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Problems solved by technology

[0004] The purpose of the present invention is to provide an array substrate and its manufacturing method, and a display device, so as to solve the problem of deformation and expansion of the adhesive layer connecting the flexible substrate and the back protection film when heated and pressurized, and further deformation of the adhesive material. Thin dents, resulting in poor crimping of circuit-bonded metal particles or broken wires at the edge of the IC

Method used

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  • Array substrate, manufacturing method therefor, and display device
  • Array substrate, manufacturing method therefor, and display device
  • Array substrate, manufacturing method therefor, and display device

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Embodiment Construction

[0041] The present invention will be further described below with reference to the accompanying drawings and exemplary embodiments, wherein the same reference numerals in the accompanying drawings all refer to the same components. Also, detailed descriptions of known arts will be omitted if they are unnecessary to illustrate the features of the present invention.

[0042] The structural diagram of the array substrate of the present invention is shown in Figure 1. The array substrate includes a flexible substrate 101, a back protection film 102 and an adhesive layer 103, and the back protection film is connected to the adhesive layer through the adhesive layer. The flexible base substrate is bonded together, and the bonding layer includes glue material and several nano fillers filled in the glue material.

[0043] Wherein, the flexible substrate is preferably a plastic substrate. Compared with the existing glass substrate, the plastic substrate has better flexibility, is less ...

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Abstract

The invention relates to the technical field of display, and especially relates to an array substrate, a manufacturing method therefor, and a display device. The array substrate comprises a flexible substrate, a back protection film, and an adhesive layer. The back protection film is adhered to the flexible substrate through the adhesive layer, and the adhesive layer comprises a glue material and a plurality of nano filling materials disposed in the glue material. When the array substrate bears a larger pressure and higher temperature, the array substrate can effectively control the deformation of the adhesive layer with the help of nano filling materials in the array substrate, thereby improving the pressure resistance and thermal resistance of the whole array substrate, and improving the technological yield during circuit binding on the array substrate.

Description

【Technical field】 [0001] The present invention relates to the field of display technology, in particular to an array substrate, a manufacturing method thereof, and a display device. 【Background technique】 [0002] In recent years, the concept of flexible display has penetrated more and more into the display market, attracting consumers' attention. The key technologies for realizing flexible display can be divided into two aspects: panel technology and module technology. The flexible module technology is very different from flat display. One of the processes in the flexible module process is to remove the large-area glass and attach the film on the back of the flexible substrate after the panel film is attached. After cutting, the circuit is bound on the flexible substrate, and then the functional film on the back is pasted. [0003] Heating and pressure are required in the process of bonding the circuit. The thermal expansion coefficients of the flexible substrate, the prot...

Claims

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Application Information

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IPC IPC(8): H01L27/32
CPCH10K59/12H10K59/1201
Inventor 陈立强孙韬
Owner BOE TECH GRP CO LTD
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