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Transition structure from dielectric suspended line circuit to rectangular waveguide

A rectangular waveguide and dielectric integration technology, applied in circuits, waveguide-type devices, electrical components, etc., can solve the problems of difficult to solve the problems of dielectric integrated suspension line circuit integration testing, low quality factor, and high loss

Active Publication Date: 2017-09-12
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a transition structure from a suspension line circuit to a rectangular waveguide composed of a multilayer circuit board riveted structure, which can realize the integration of a new dielectric integrated suspension line circuit with external components and testing equipment, and solve the problem of existing microstrip and common Microwave and millimeter-wave integrated circuits such as planar waveguides are difficult to solve the problem of integrated testing with dielectric integrated suspension lines due to serious dispersion, low quality factor, and high loss at high frequencies. Measurement provides the solution

Method used

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  • Transition structure from dielectric suspended line circuit to rectangular waveguide
  • Transition structure from dielectric suspended line circuit to rectangular waveguide
  • Transition structure from dielectric suspended line circuit to rectangular waveguide

Examples

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Effect test

Embodiment approach 1

[0042] Embodiment 1: For ordinary multi-layer circuit board riveting, when the number of circuit boards is 6, the 6 circuit boards are respectively the first circuit board, the second circuit board, the third circuit board, the fourth circuit board, the fifth The circuit board, the sixth circuit board, the local area of ​​the second circuit board is partially hollowed out to form a hollow cavity A, and the local area of ​​the fourth circuit board is partially hollowed out to form a hollow cavity B. The metal on the reverse side of the first circuit board layer covering the top of the hollow cavity A, the metal layer on the front of the third circuit board covers the bottom of the hollow cavity A, and the hollow cavity A is composed of the metal layer on the front of the third circuit board and the metal layer on the back of the first circuit board Suspension line air cavity structure, the metal layer on the reverse side of the third circuit board is covered above the hollow cav...

Embodiment approach 2

[0047] Embodiment 2: (that is, replace the first circuit board and the third circuit board with three circuit boards respectively in scheme 1, which also shows that this invention can use several circuit boards for each circuit board in the original medium integrated suspension line board, which embodies the arbitrariness of the invention) For common multilayer circuit board riveting, when the number of circuit boards is 10, the 10 circuit boards are respectively the first circuit board, the second circuit board, and the third circuit board , the fourth circuit board, the fifth circuit board, the sixth circuit board, the seventh circuit board, the eighth circuit board, the ninth circuit board, the tenth circuit board, the local area of ​​the fourth circuit board is partially hollowed out to form a hollow Cavity A, the local area of ​​the sixth circuit board is partially hollowed out to form a hollow cavity B, the metal layer on the reverse side of the third circuit board is cov...

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Abstract

The invention discloses a transition structure from a dielectric suspended line circuit to a rectangular waveguide, and the structure comprises a first circuit board, a second circuit board, a third circuit board, a fourth circuit board, a fifth circuit board and a sixth circuit board, wherein the first, second, third, fourth, fifth and sixth circuit boards are sequentially riveted from the top to the bottom. The hollow-out cutting of the local areas of the second and fourth circuit boards is carried out to form a hollow-out cavity A and a hollow-out cavity B. The hollow-out cavity A, a metal layer on the front surface of the third circuit board, and a metal layer on the back surface of the first circuit board form a first suspended line air cavity structure. The hollow-out cavity B, a metal layer on the back surface of the third circuit board, and a metal layer on the front surface of the fifth circuit board form a second suspended line air cavity structure. The hollow-out cutting of the local parts of the first, second, fourth and fifth circuit boards is carried out to form a hollow-out cavity C, a hollow-out cavity D, a hollow-out cavity E and a hollow-out cavity F. The structure can achieve the integration of a novel dielectric integrated suspended line circuit and an external parts and testing equipment.

Description

technical field [0001] The invention relates to the field of radio frequency circuits and microwave and millimeter circuits, in particular to a transition structure from a dielectric integrated suspension line circuit to a rectangular waveguide. Background technique [0002] With the development of radio frequency circuits and microwave and millimeter circuits, multilayer circuit structures have been extensively studied and applied in order to achieve superior circuit performance such as miniaturization and high integration of circuit structures. The multi-layer circuit structure can realize the miniaturization of the circuit structure, high integration and three-dimensional integration of active and passive circuits. In non-planar transmission lines, waveguide suspension lines (including suspended strip lines, suspended microstrip lines, etc.) circuits have been proven to be very excellent transmission line systems. Compared with other planar transmission lines, the metal l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/10H01P5/107
CPCH01P5/10H01P5/107
Inventor 马凯学陈殷洲王勇强
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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