Heating substrate for thermal printing head, and manufacturing method thereof

Abstract

The invention provides a heating substrate for a thermal printing head. One end of a specific electrode is connected with a heating resistor body, first lead-out graphs are led out from the other end of the specific electrode, the first lead-out graphs are distributed on a ground glaze layer and an insulation substrate, and a connection part with a notch part is led out from each first lead-out graph; a first metal conductor layer formed in a manner of evaporating or sputtering a chromium target material or a nickel-chromium target material is arranged on the insulation substrate, and the beginning end of the first metal conductor layer covers the notch parts; a second metal conductor layer is arranged on the first metal conductor layer, expected graphs are formed on the two conductor layers, a welding pad and welding flux graph layer is arranged on the second metal conductor layer, a semiconductor chip is connected to the welding pad and welding flux graph layer, a space between the welding pad and welding flux graph layer and the semiconductor chip is filled with a filling layer, a silver conductor layer is arranged on the tail end part of the welding pad and welding flux graph layer, and an insertion element is connected to the silver conductor layer; a protection layer covers from the surface of a common electrode to the surface of a part of the first lead-out graphs; and an encapsulation protection layer is formed in an area between a part of the protection layer and a part of the insertion element. The heating substrate is capable of lowering the cost on the premise of no influence on product quality.

Description

technical field [0001] The invention relates to the field of thermal printing, in particular to a heating substrate for a thermal printing head and a manufacturing method thereof. Background technique [0002] In the prior art, the common electrodes and individual electrodes of the heat-generating substrates for thermal print heads are usually printed and sintered with organic gold paste. Since the price of gold is very expensive, in order to reduce product costs, reducing the amount of gold used is the most important method for thermal printing. One of the development trends of head heating substrate. [0003] In order to solve the above problems, the heat-generating substrates for thermal print heads in the prior art use silver instead of gold to reduce the amount of gold used. However, when gold and silver dissimilar metals are connected, cracks often occur at the gold-silver joint due to process problems. , Disconnection problem. Contents of the invention [0004] In...

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Problems solved by technology

[0003] In order to solve the above problems, the heat-generating substrates for thermal print heads in the prior art use silver instead of gold to reduce the amount of gold used. However, when gold and silver dissimilar metals are connected, cracks often occur at the gold-silver joint due to process problems. , disconnection problem

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