Laser scribing device
A laser scribing and equipment technology, applied in laser welding equipment, lasers, welding equipment, etc., can solve problems such as delay, difficulty in increasing substrate cutting speed, and inability to irradiate laser beams
Inactive Publication Date: 2017-09-22
TOP ENG CO LTD
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- Application Information
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Problems solved by technology
[0007] However, in the prior art, mechanically controlling the height of the irradiation hole for irradiating the laser beam is delayed in response, with the result that it is difficult to increase the substrate cutting speed
In addition, in the prior art, the horizontal distance between the distance sensor that measures the distance from the substrate and the irradiation hole that irradiates the laser beam is separated, and as a result, the laser beam cannot be irradiated at an accurate depth
Method used
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Embodiment approach
[0033] figure 1 is a diagram showing the configuration of a laser scribing apparatus according to an exemplary embodiment of the present invention, and figure 2 is a diagram showing a configuration of a distance measurement sensor assembly provided in a laser scribing apparatus according to an exemplary embodiment of the present invention.
[0034] A laser scribing apparatus according to an exemplary embodiment of the present invention includes a pallet 2 onto which a substrate 1 is loaded, and a scribing head unit 10 disposed to move relative to the pallet 2 . The gantry 2 is fixed and the scribing head unit 10 is movable, the scribing head unit 10 is fixed and the scribing head unit 10 is movable, or both the gantry 2 and the scribing head unit 10 are movable of. The scribing head unit 10 may be disposed in a stand (not shown) disposed across an upper side of the pallet 2 . The basic configuration of the laser scribing device can follow Korean Patent Laid-Open Publicatio...
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The present invention provides a laser scribing device capable of easily changing the focal length of a laser light when the laser light is used for cutting a brittle material substrate. The laser scribing device comprises a scribing head unit and a pallet, and a substrate is loaded on the pallet, wherein the scribing head unit moves relatively to the pallet and the scribing head unit comprises a lens assembly and a distance measuring sensor assembly; the lens assembly receives a cutting laser beam from a laser generating device to change a focal point of a laser beam for cutting; the distance measuring sensor assembly comprises a distance measuring sensor and a light beam passing unit; the distance measuring sensor includes a light emitting unit for generating a measuring laser beam and a light receiving unit for receiving a measuring laser beam, and a cutting laser beam having a controlled focal length in the lens assembly passes through the light beam passing unit.
Description
technical field [0001] The invention relates to a laser scribing device. More specifically, the present invention relates to a laser scribing apparatus that measures a distance from a brittle material substrate and actively adjusts the focus of a laser according to the distance from the brittle material substrate. Background technique [0002] There are cases where laser light is used for precision cutting as a method of cutting an object to be cut. Cutting with lasers is used not only for cutting sheet metal, but also for cutting brittle materials such as glass. [0003] For example, a laser is used to cut a flat display panel such as a liquid crystal display device. A prior art scribing device for cutting liquid crystal display devices rotatably moves a cutter wheel made of diamond or cemented carbide while applying a predetermined pressure to the substrate surface to form a scribe line on the substrate surface And the substrate is cut through a fracture process. [00...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B23K26/362B23K26/70B23K26/06B23K26/38
CPCB23K26/0648B23K26/38B23K26/361B23K26/702H01L21/268H01L21/76H01L21/78H01S3/0007
Inventor 徐容珪
Owner TOP ENG CO LTD