Moisture and heat resistant LED encapsulation silica gel and its preparation method and application

A technology of LED packaging and heat and humidity resistance, applied in the field of material chemistry, can solve the problems of easy cracking, degumming, moisture absorption, etc., and achieve the effect of solving moisture absorption, improving heat and humidity resistance, and simple process

Active Publication Date: 2020-05-19
广州惠利电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to address the above problems and provide a heat-and-humidity-resistant LED packaging silica gel, which improves the heat-and-moisture resistance of SMD devices and solves the problem of moisture absorption in the storage process of SMD devices. The problem of easy cracking and degumming during the reflow soldering process reduces the risk and improves production efficiency

Method used

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  • Moisture and heat resistant LED encapsulation silica gel and its preparation method and application
  • Moisture and heat resistant LED encapsulation silica gel and its preparation method and application
  • Moisture and heat resistant LED encapsulation silica gel and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] A kind of heat and humidity resistant LED encapsulation silicone, composed of A component and B component,

[0065] The A component is prepared from the following raw materials:

[0066] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.48 (Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.09 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 30000cps, the refractive index is 1.543, the molecular weight MW=951, PDI=1.253) 50g

[0067] Platinum catalyst (content is 5000ppm Pt-1,3,5,7 tetramethyl-divinylsilane toluene solution) 0.2g

[0068] Addition type tackifier (boron type tackifier,

[0069] CH 2 OCHCH 3 h 6 (CH 3 O) 2 Si0(Ph 2 SiO 2 / 2)0.68(MeSiO 2 / 2)0.25(BO 3 / 2)0.07OSi(OCH 3 ) 2 CH 2 OCHCH 3 h 6 ) 1.0g

[0070] The B component is mainly prepared from the following raw materials:

[0071] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.48 (Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.09 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 30000cps, the refractive index is 1.543, ...

Embodiment 2

[0080] A kind of heat and humidity resistant LED encapsulation silicone, composed of A component and B component,

[0081] The A component is prepared from the following raw materials:

[0082] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.5(Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 40000cps, the refractive index is 1.545, the molecular weight MW=1025, PDI=1.237) 50g

[0083] Platinum catalyst (content is 5000ppm Pt-1,3,5,7 tetramethyl-divinylsilane toluene solution) 0.2g

[0084] Addition type tackifier (boron type tackifier,

[0085] CH 2 OCHCH 3 h 6 (CH 3 O) 2 Si0(Ph 2 SiO 2 / 2)0.68(MeSiO 2 / 2)0.25(BO 3 / 2)0.07OSi(OCH 3 ) 2 CH 2 OCHCH 3 h 6 ) 1.0g

[0086] The B component is mainly prepared from the following raw materials:

[0087] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.5(Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 40000cps, the refractive index is 1.545, the...

Embodiment 3

[0096] A heat-and-humidity-resistant LED encapsulation silicone, composed of components A and B,

[0097] The A component is prepared from the following raw materials:

[0098] Methylphenyl vinyl silicone resin ((PhSiO3 / 2 )0.51 (Ph 2 SiO 2 / 2 )0.15 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 45000cps, the refractive index is 1.543, the molecular weight MW=1105, PDI=1.221) 50g

[0099] Platinum catalyst (content is 5000ppm Pt-1,3,5,7 tetramethyl-divinylsilane toluene solution) 0.2g

[0100] Addition type tackifier (boron type tackifier,

[0101] CH 2 OCHCH 3 h 6 (CH 3 O) 2 Si0(Ph 2 SiO 2 / 2)0.68(MeSiO 2 / 2)0.25(BO 3 / 2)0.07OSi(OCH 3 ) 2 CH 2 OCHCH 3 h 6 ) 1.0g

[0102] The B component is mainly prepared from the following raw materials:

[0103] Methylphenyl vinyl silicone resin (((PhSiO 3 / 2 )0.51 (Ph 2 SiO 2 / 2 )0.15 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 45000cps, the refractive index is 1.543, the molecular wei...

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Abstract

The invention relates to damp-heat-resistant LED packaging silica gel and a preparation method and application thereof, and belongs to the technical field of material chemistry. The damp-heat-resistant LED packaging silica gel is composed of a component A and a component B, wherein the component A includes a methyl phenyl vinyl silicon resin, a platinum catalyst, and an addition-type tackifier, and the component B includes a methyl phenyl vinyl silicon resin, a methyl phenyl hydrogen-containing silicon resin, and a reaction inhibitor. The damp-heat-resistant LED packaging silica gel is obtained by matching selected specific raw materials. Through adoption of the damp-heat-resistant LED packaging silica gel, damp heat resistance of an SMD device is improved, and the problems that an SMD device absorbs moisture in a storage process, and the gel is prone to crack and fall off in a lead-free reflow soldering process are solved, so that the risk is reduced and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of material chemistry, in particular to a heat-and-humidity-resistant LED packaging silica gel and a preparation method and application thereof. Background technique [0002] At present, a large part of the current commercialized LED lighting devices are packaged in SMD (Surface Mount Type), and high-fold LED silicone resin has excellent transparency, heat resistance and UV aging resistance, so it has become a popular choice for SMD devices. The main packaging material. [0003] However, in the actual application process, after the SMD device is packaged with high-fold silicone resin, due to the sealing property or the hygroscopicity and gas permeability of the packaging material, it will inevitably absorb water vapor during the storage process, and the SMD device needs to be mounted. On the PCB circuit board, in the lead-free reflow soldering process, the moisture-absorbing SMD devices are prone to colloid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/14C09J183/07C09J183/05C09J183/14C09J11/08H01L33/56
CPCC08L83/04C08L2201/08C08L2203/206C08L2205/02C08L2205/025C08L2205/035C09J11/08C09J183/04H01L33/56C08L83/14
Inventor 肖少岗韩小兵蔡国章郑长利
Owner 广州惠利电子材料有限公司
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