Moisture and heat resistant LED encapsulation silica gel and its preparation method and application
A technology of LED packaging and heat and humidity resistance, applied in the field of material chemistry, can solve the problems of easy cracking, degumming, moisture absorption, etc., and achieve the effect of solving moisture absorption, improving heat and humidity resistance, and simple process
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Embodiment 1
[0064] A kind of heat and humidity resistant LED encapsulation silicone, composed of A component and B component,
[0065] The A component is prepared from the following raw materials:
[0066] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.48 (Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.09 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 30000cps, the refractive index is 1.543, the molecular weight MW=951, PDI=1.253) 50g
[0067] Platinum catalyst (content is 5000ppm Pt-1,3,5,7 tetramethyl-divinylsilane toluene solution) 0.2g
[0068] Addition type tackifier (boron type tackifier,
[0069] CH 2 OCHCH 3 h 6 (CH 3 O) 2 Si0(Ph 2 SiO 2 / 2)0.68(MeSiO 2 / 2)0.25(BO 3 / 2)0.07OSi(OCH 3 ) 2 CH 2 OCHCH 3 h 6 ) 1.0g
[0070] The B component is mainly prepared from the following raw materials:
[0071] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.48 (Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.09 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 30000cps, the refractive index is 1.543, ...
Embodiment 2
[0080] A kind of heat and humidity resistant LED encapsulation silicone, composed of A component and B component,
[0081] The A component is prepared from the following raw materials:
[0082] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.5(Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 40000cps, the refractive index is 1.545, the molecular weight MW=1025, PDI=1.237) 50g
[0083] Platinum catalyst (content is 5000ppm Pt-1,3,5,7 tetramethyl-divinylsilane toluene solution) 0.2g
[0084] Addition type tackifier (boron type tackifier,
[0085] CH 2 OCHCH 3 h 6 (CH 3 O) 2 Si0(Ph 2 SiO 2 / 2)0.68(MeSiO 2 / 2)0.25(BO 3 / 2)0.07OSi(OCH 3 ) 2 CH 2 OCHCH 3 h 6 ) 1.0g
[0086] The B component is mainly prepared from the following raw materials:
[0087] Methylphenyl vinyl silicone resin ((PhSiO 3 / 2 )0.5(Ph 2 SiO 2 / 2 )0.16 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 40000cps, the refractive index is 1.545, the...
Embodiment 3
[0096] A heat-and-humidity-resistant LED encapsulation silicone, composed of components A and B,
[0097] The A component is prepared from the following raw materials:
[0098] Methylphenyl vinyl silicone resin ((PhSiO3 / 2 )0.51 (Ph 2 SiO 2 / 2 )0.15 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 45000cps, the refractive index is 1.543, the molecular weight MW=1105, PDI=1.221) 50g
[0099] Platinum catalyst (content is 5000ppm Pt-1,3,5,7 tetramethyl-divinylsilane toluene solution) 0.2g
[0100] Addition type tackifier (boron type tackifier,
[0101] CH 2 OCHCH 3 h 6 (CH 3 O) 2 Si0(Ph 2 SiO 2 / 2)0.68(MeSiO 2 / 2)0.25(BO 3 / 2)0.07OSi(OCH 3 ) 2 CH 2 OCHCH 3 h 6 ) 1.0g
[0102] The B component is mainly prepared from the following raw materials:
[0103] Methylphenyl vinyl silicone resin (((PhSiO 3 / 2 )0.51 (Ph 2 SiO 2 / 2 )0.15 (Me 2 SiO 2 / 2 )0.07 (ViMe 2 SiO 1 / 2 )0.27, the viscosity is 45000cps, the refractive index is 1.543, the molecular wei...
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