Polyamic acid, polyimide resin and polyimide film

A polyimide film and polyimide resin technology, applied in the field of polyimide film, can solve the problems of insufficient mechanical properties, yellowness and visible light transmittance, and achieve high optical isotropy and excellent Effects of mechanical properties and high heat resistance

Active Publication Date: 2017-09-26
KOLON IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical properties, yellowness, and visible light transmittance of the above-mentioned polyimides are insufficient for use in insulating films for semiconductors, insulating films for TFT-LCDs, electrode protective films, and base layers for flexible displays.

Method used

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  • Polyamic acid, polyimide resin and polyimide film
  • Polyamic acid, polyimide resin and polyimide film
  • Polyamic acid, polyimide resin and polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A 500mL reactor equipped with stirrer, nitrogen injection device, dropping funnel, temperature controller and condenser was purged with nitrogen, while 384.316g of dimethylacetamide (DMAc) was placed in the reactor, followed by 49.972 g (0.13 mol) of FFDA was dissolved therein. Then, 15.299 g (0.052 mol) of BPDA was added, the reaction was carried out for 5 hours, and 34.652 g (0.078 mol) of 6FDA was added. The resulting solution was kept at room temperature and reacted for 18 hours, thereby obtaining a solid content of 20% by weight, a viscosity (viscosity value using a Brookfield viscometer (RVDV-II+P), at 25° C., using a #6 or #7 spindle , measured twice at 50 rpm, and then averaged) is a polyamic acid solution of 150 poise. After the reaction is terminated, the obtained solution is coated on a stainless steel plate so that the thickness is 10 to 20 μm, dried with hot air at 80°C for 20 minutes, 120°C for 20 minutes, and 300°C for 10 minutes, slowly cooled and separ...

Embodiment 2

[0049] A 500mL reactor equipped with stirrer, nitrogen injection device, dropping funnel, temperature controller and condenser was purged with nitrogen, while 407.493g of dimethylacetamide (DMAc) was placed in the reactor, followed by 49.972g g (0.13 mol) of FFDA was dissolved therein. Then, 11.475 g (0.039 mol) of BPDA was added, the reaction was carried out for 5 hours, and 40.427 g (0.091 mol) of 6FDA was added. The resulting solution was kept at room temperature and reacted for 18 hours to obtain a polyamic acid solution having a solid content of 20% by weight and a viscosity of 127 poise. Subsequent steps were performed in the same manner as in Example 1, thereby producing a polyimide film having a thickness of 10 square.

Embodiment 3

[0051] A 500mL reactor equipped with stirrer, nitrogen injection device, dropping funnel, temperature controller and condenser was purged with nitrogen, while 384.349g of dimethylacetamide (DMAc) was placed in the reactor, followed by 46.128 g (0.12 mol) of FFDA was dissolved therein. Then, 7.061 g (0.024 mol) of BPDA was added, the reaction was carried out for 5 hours, and 42.648 g (0.096 mol) of 6FDA was added. The resulting solution was kept at room temperature and reacted for 18 hours to obtain a polyamic acid solution having a solid content of 20% by weight and a viscosity of 112 poise. Subsequent steps were performed in the same manner as in Example 1, thereby producing a polyimide film having a thickness of 12 μm.

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Abstract

The present invention relates to a poliamic acid which is a polymerization reaction product of diamine and dianhydride, wherein the diamine comprises 9,9-bis(3-fluoro-4-aminophenyl)fluororene (FFDA), and the dianhydride comprises 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and, more particularly, to a polyamide resin which is an imide thereof, and a polyamide film.

Description

technical field [0001] The invention relates to a polyamic acid, a polyimide resin prepared from the polyamic acid and a colorless and transparent polyimide film. Background technique [0002] Generally, a polyimide (PI) film is formed of polyimide resin. Here, "polyimide resin" refers to a highly heat-resistant resin produced by solution-polymerizing aromatic dianhydride with aromatic diamine or aromatic diisocyanate, thereby producing polyamic acid derivatives , and then the polyamic acid derivatives undergo a ring-closing reaction and are dehydrated at high temperature to be imidized. In the preparation of polyimide resins, examples of aromatic dianhydrides may include pyromellitic dianhydride (PMDA), biphenyltetracarboxylic dianhydride (BPDA), etc., and examples of aromatic diamines may include Diaminodiphenyl ether (ODA), p-phenylenediamine (p-PDA), m-phenylenediamine (m-PDA), diaminodiphenylmethane (MDA), bisaminophenylhexafluoropropane (HFDA), etc. [0003] Since p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/1042C08G73/1067C08J5/18C08J2379/08C08G73/1039C08L79/08
Inventor 梁钟源郑鹤基
Owner KOLON IND INC
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