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Polishing composition and polishing method

A composition and technology of organic compounds, applied in polishing compositions containing abrasives, grinding machine tools, grinding devices, etc., can solve the problems of corrosion, surfactant-promoted etching, weak resistance, etc.

Active Publication Date: 2019-06-18
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, depending on the type of metal, corrosion inhibitors and surfactants may promote etching and corrosion.
In particular, transition metals with a standard electrode potential of -0.45 V to 0.33 V have weak resistance to chemical agents such as water, acids, complexing agents, and oxidizing agents, and thus tend to promote etching and corrosion

Method used

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  • Polishing composition and polishing method
  • Polishing composition and polishing method
  • Polishing composition and polishing method

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Embodiment Construction

[0013] One embodiment of the present invention will be described in detail. The polishing composition of the present embodiment is a polishing composition for polishing an object containing a transition metal having a standard electrode potential of -0.45 V to 0.33 V, and contains abrasive grains and an organic compound for metal protection. . The metal-protecting organic compound has an interactive functional group that interacts with an object to be polished and an inhibitory functional group that inhibits the approach of abrasive grains to the object to be polished.

[0014] When an object to be polished containing a transition metal having a standard electrode potential of -0.45 V to 0.33 V is polished using the polishing composition of the present embodiment, the object to be polished is less likely to be etched or corroded. The reason for this will be described in detail below.

[0015] In order to suppress etching and corrosion of metals caused by polishing compositio...

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Abstract

The present invention provides a polishing composition that does not easily etch, corrosion. The polishing composition contains abrasive grains and an organic compound for metal protection. The organic compound for metal protection contains an interactive functional group and an inhibitory functional group. The interactive functional group is a functional group that interacts with an object to be polished containing a transition metal having a standard electrode potential of -0.45V or more and 0.33V or less. The inhibitory functional group is A functional group that inhibits the approach of abrasive grains to objects to be polished.

Description

technical field [0001] The present invention relates to a polishing composition and a polishing method. Background technique [0002] In order to suppress etching and corrosion of metals by polishing compositions, anticorrosion agents and surfactants are added to polishing compositions used for polishing metals (see, for example, Patent Document 1). However, depending on the type of metal, corrosion inhibitors and surfactants may promote etching and corrosion. In particular, transition metals having a standard electrode potential of -0.45 V to 0.33 V have weak resistance to chemical agents such as water, acids, complexing agents, and oxidizing agents, and thus tend to promote etching and corrosion. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2009-81300 Contents of the invention [0006] The problem to be solved by the invention [0007] Therefore, the object of the present invention is to solve the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/14B24B37/00C09G1/02H01L21/304
CPCH01L21/3212C09G1/02C09K3/14B24B37/00H01L21/304
Inventor 安井晃仁
Owner FUJIMI INCORPORATED
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