A method of manufacturing a flip-chip light-emitting diode chip

Abstract

The invention discloses a manufacturing method of a flip light-emitting-diode (LED) chip, and belongs to the technical field of semiconductors. The method includes: sequentially growing an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate; forming a groove extending to the N-type semiconductor layer; forming an N-type electrode on the N-type semiconductorlayer, and forming a P-type electrode on the P-type semiconductor layer, wherein top materials are all alloys of titanium, tungsten and gold; forming an reflective layer on a region other than an arrangement region of the N-type electrode on the N-type semiconductor layer and a region other than an arrangement region of the P-type semiconductor on the P-type semiconductor layer; forming an insulating layer on the reflective layer; carrying out physical bombardment on the top of the N-type electrode and the top of the P-type electrode in a vacuum environment to remove contaminants; and formingan N-type pad and a P-type pad, wherein the N-type pad and the P-type pad are arranged in a spaced manner, and a formation rate of a starting portion is greater than a formation rate of a subsequent portion. The method can improve chip stability.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a flip-chip light-emitting diode chip. Background technique [0002] A light-emitting diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. Since gallium nitride (GaN)-based LEDs were successfully developed by Japanese scientists in the 1990s, with the continuous advancement of process technology, the luminous brightness of LEDs has continued to increase. As a new-generation solid-state lighting source with high efficiency, environmental protection and green, LED has the advantages of low voltage, low power consumption, small size, light weight, long life and high reliability, and is rapidly and widely used in traffic lights, automotive interior and exterior lights, Urban landscape lighting, mobile phone backlight, outdoor full-color display and other fields. Especially in the fi...

AI Technical Summary

Problems solved by technology

[0008] The embodiment of the present invention provides a method for manufacturing a flip-chip light-emitting diode chip and a flip-chip light-emitting diode chip, which can solve the problem that the solution pollutants and natural oxide layers formed on the electrode surface in the prior art affect the contact with the pad and affect the flip-chip LED. The problem of chip reliability

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