Method of evaluating glass substrate heat shrinkage

A glass substrate, thermal shrinkage technology, applied in the direction of material thermal expansion coefficient, measuring device, instrument, etc., can solve the problem of not measuring the thermal shrinkage of the whole board, uneven thermal shrinkage, etc., achieve good application prospects, simplify the evaluation process, shorten the evaluation process effect of time

Active Publication Date: 2017-10-03
DONGXU OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the large-size glass substrates currently on the market, such as the 5th generation line (1100mm×1250mm) and the 10th generation line (2880mm×3080mm), there is no method to measure the thermal shrinkage of the whole board, especially in the t

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  • Method of evaluating glass substrate heat shrinkage
  • Method of evaluating glass substrate heat shrinkage
  • Method of evaluating glass substrate heat shrinkage

Examples

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Example Embodiment

[0086] Example 1

[0087] This example is used to illustrate the method for evaluating the thermal shrinkage of a glass substrate provided by the present invention.

[0088] (1) Preparation of the bottom plate

[0089] According to the size of the glass substrate to be tested (TFT-LCD G4 0.5mm glass substrate, purchased from Corning Corporation, size 830mm×650mm), prepare a rectangular base plate with a size larger than the glass substrate and the material is plastic, and mark the center of the base plate with a laser spotter The origin O' in the form of a cross, and then use a laser scriber to demarcate the X and Y axes that are perpendicular to each other through the origin O', and divide the glass substrate with measurement into four areas, where the X axis is parallel to the long side of the bottom plate, And divide the X-axis and Y-axis equally to form a grid on the base plate. The grid is rectangular, its length and width are both 200mm, and an intersection of the grid...

Example Embodiment

[0107] Example 2

[0108] This example is used to illustrate the method for evaluating the shrinkage of a glass substrate provided by the present invention.

[0109] Carry out according to the method of Example 1, the difference is that the glass substrate to be tested is a TFT-LCD G60.4mm glass substrate (purchased from Corning, with a size of 1800mm×1500mm), and correspondingly, a glass substrate with a size larger than that of the glass substrate to be tested is selected. plastic bottom plate; in step (1), the grid is rectangular, its length is 500mm, and its width is 300mm; in step (2), the heat treatment conditions are: at a heating rate of 60°C / min, from room temperature (25°C) The temperature was raised to 400°C, kept for 40s, then cooled to 250°C at a cooling rate of 50°C / min, and then air-cooled to room temperature (25°C).

[0110] Mark a coordinate point in each of the four areas of the base plate (respectively A' 5 , A' 6 , A' 7 and A' 8 ), corresponding to the...

Example Embodiment

[0113] Example 3

[0114] This example is used to illustrate the method for evaluating the shrinkage of a glass substrate provided by the present invention.

[0115] Carry out according to the method of Example 1, the difference is that the glass substrate to be tested is TFT-LCD G8.5 0.5mm glass substrate (purchased from Corning, the size is 2500mm×2200mm), and correspondingly, the size of the glass to be tested is larger than that of the glass to be tested. The plastic bottom plate of the substrate; in step (1), the grid is rectangular, its length is 500mm, and its width is 400mm; in step (2), the heat treatment conditions are: at a heating rate of 50 ° C / min 25°C) to 600°C, hold for 60s, then cool down to 250°C at a cooling rate of 60°C / min, and then air-cool to room temperature (25°C).

[0116] Mark a coordinate point in each of the four areas of the base plate (respectively A' 9 , A' 10 , A' 11 and A' 12 ), corresponding to the four points to be measured on the glass...

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Abstract

The invention relates to the field of glass, and discloses a method of evaluating glass substrate heat shrinkage. The method comprises the following steps: by adopting a coordinate axis calibration manner and matching with determination of a delta alpha axis representing an axial shrinkage ratio difference, an alpha surface representing a surface shrinkage ratio and an alpha line index representing a linear shrinkage ratio, comprehensive evaluation on the heat shrinkage condition of a glass substrate is realized. Particularly, by adopting a mesh generation manner, the heat shrinkage condition of each region of the glass substrate can be more intuitively observed and analyzed, so that reflection of the uneven heat shrinkage problem of the glass substrate and contrastive analysis among different glass substrates are more facilitated.

Description

technical field [0001] The invention relates to the field of glass, in particular to a method for evaluating thermal shrinkage of a glass substrate. Background technique [0002] In recent years, portable electronic products such as notebook computers, tablet computers, smart phones, and smart wearable devices have become popular rapidly, and liquid crystal display (LCD) products with characteristics such as thinness, lightness, high resolution, and high image quality are popular among the public. Glass substrate is an important part of LCD. With the development of LCD technology, higher and higher requirements are put forward for the performance of glass substrate materials. For example, in the active matrix liquid crystal display, the thin film transistor and the color filter layer are directly formed on the glass substrate through multiple heating and photolithography processes. In order to ensure the proper overlap of multiple photolithography processes, the thermal stab...

Claims

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Application Information

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IPC IPC(8): G01N25/16G01B11/02
CPCG01B11/02G01N25/16
Inventor 王肖义张广涛李媚寰周波闫冬成王丽红郑权王博
Owner DONGXU OPTOELECTRONICS TECH CO LTD
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