Method of evaluating glass substrate heat shrinkage
A glass substrate, thermal shrinkage technology, applied in the direction of material thermal expansion coefficient, measuring device, instrument, etc., can solve the problem of not measuring the thermal shrinkage of the whole board, uneven thermal shrinkage, etc., achieve good application prospects, simplify the evaluation process, shorten the evaluation process effect of time
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[0086] Example 1
[0087] This example is used to illustrate the method for evaluating the thermal shrinkage of a glass substrate provided by the present invention.
[0088] (1) Preparation of the bottom plate
[0089] According to the size of the glass substrate to be tested (TFT-LCD G4 0.5mm glass substrate, purchased from Corning Corporation, size 830mm×650mm), prepare a rectangular base plate with a size larger than the glass substrate and the material is plastic, and mark the center of the base plate with a laser spotter The origin O' in the form of a cross, and then use a laser scriber to demarcate the X and Y axes that are perpendicular to each other through the origin O', and divide the glass substrate with measurement into four areas, where the X axis is parallel to the long side of the bottom plate, And divide the X-axis and Y-axis equally to form a grid on the base plate. The grid is rectangular, its length and width are both 200mm, and an intersection of the grid...
Example Embodiment
[0107] Example 2
[0108] This example is used to illustrate the method for evaluating the shrinkage of a glass substrate provided by the present invention.
[0109] Carry out according to the method of Example 1, the difference is that the glass substrate to be tested is a TFT-LCD G60.4mm glass substrate (purchased from Corning, with a size of 1800mm×1500mm), and correspondingly, a glass substrate with a size larger than that of the glass substrate to be tested is selected. plastic bottom plate; in step (1), the grid is rectangular, its length is 500mm, and its width is 300mm; in step (2), the heat treatment conditions are: at a heating rate of 60°C / min, from room temperature (25°C) The temperature was raised to 400°C, kept for 40s, then cooled to 250°C at a cooling rate of 50°C / min, and then air-cooled to room temperature (25°C).
[0110] Mark a coordinate point in each of the four areas of the base plate (respectively A' 5 , A' 6 , A' 7 and A' 8 ), corresponding to the...
Example Embodiment
[0113] Example 3
[0114] This example is used to illustrate the method for evaluating the shrinkage of a glass substrate provided by the present invention.
[0115] Carry out according to the method of Example 1, the difference is that the glass substrate to be tested is TFT-LCD G8.5 0.5mm glass substrate (purchased from Corning, the size is 2500mm×2200mm), and correspondingly, the size of the glass to be tested is larger than that of the glass to be tested. The plastic bottom plate of the substrate; in step (1), the grid is rectangular, its length is 500mm, and its width is 400mm; in step (2), the heat treatment conditions are: at a heating rate of 50 ° C / min 25°C) to 600°C, hold for 60s, then cool down to 250°C at a cooling rate of 60°C / min, and then air-cool to room temperature (25°C).
[0116] Mark a coordinate point in each of the four areas of the base plate (respectively A' 9 , A' 10 , A' 11 and A' 12 ), corresponding to the four points to be measured on the glass...
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