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High-cross section difference resistant high-temperature release liner and preparation process

A high-temperature release film and manufacturing process technology, applied in the direction of flat products, applications, coatings, etc., can solve the problems of high cross-section difference of soft and hard bonded boards, and achieve simplified production equipment, good lamination conformability, and simple structure Effect

Pending Publication Date: 2017-10-10
昆山致信天城电子材料有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the current situation of the use of release film for circuit board...

Method used

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  • High-cross section difference resistant high-temperature release liner and preparation process
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  • High-cross section difference resistant high-temperature release liner and preparation process

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Embodiment Construction

[0031] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0032] A high-temperature release film resistant to high step difference, characterized in that it includes from top to bottom: a first release layer 1, a high-extensibility support layer 2, and a second release layer 3; the first release layer 1 and the second release layer 3 are both polymethylpentene; the high-stretch support layer is nylon-modified polyolefin.

[0033] The high-temperature resistant release film is produced by a three-cavity die casting machine, and is formed at one time, with a total thickness of 20-300um.

[0034] The first release layer and the second release layer, the polymethylpentene used is one or more of Mitsui Chemicals MX004, MX002, MX002O, RT18, RT31, DX845, DX231, DX820, DX310, MBZ230, DX560M mixture; the thickness is 2-20um respectively. The above models are all Mitsui Chemicals brands, and the polymet...

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Abstract

The invention discloses a high-cross section difference resistant high-temperature release liner and a manufacturing process and belongs to the field of electronic products. The high-cross section difference resistant high-temperature release liner comprises three layers: a release layer, a high-elongation supporting layer and a release layer. The release layers are polymethylpentene, and the high-elongation supporting layer is nylon modified polyolefins. The invention further discloses a preparation process for the high-cross section difference resistant high-temperature release liner. The high-cross section difference resistant high-temperature release liner has the beneficial effects that the high-cross section difference resistant high-temperature release liner is of a three-layer structure and has a simpler structure, the layers form a whole, a referred five-layer structure that a bonding layer exists between a release layer and a core layer on the market is not needed, production equipment is further simplified, a traditional casting machine is used for one-time production, and the process is simple and convenient; and the high-cross section difference resistant high-temperature release liner has good lamination performance, can meet requirements on lamination use of FPC clients and is especially suitable for high-cross section difference lamination filling of soft and hard combined boards.

Description

technical field [0001] The invention relates to a high-temperature release film resistant to high step difference and a manufacturing process, belonging to the field of electronic products. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and are widely used in computers and their peripheral equipment, communication products, and consumer electronics products. In the process of circuit board processing, especially in the lamination process of flexible circuit boards and soft and hard boards, release film materials are used to prevent material adhesion. [0003] At present, the current situation of the use of release film for circuit boards in China is that there is a high cross-sectional difference between soft and hard boards. Contents of the invention [0004] In order to improve the current situation of the use of the domestic circuit board press-fit release film, especially the situation of the high section dif...

Claims

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Application Information

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IPC IPC(8): B29C41/32B32B27/06B32B27/32B32B7/06B29L7/00
CPCB29C41/32B32B7/06B32B27/06B32B27/32B29L2007/00
Inventor 付有虎董青山
Owner 昆山致信天城电子材料有限公司
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