A kind of contact method of probe and pcb
A probe and needle tip technology, applied in the field of contact between probe and PCB, can solve the problems of compensation value exceeding the normal range, time-consuming and laborious, long time, etc., to achieve good contact, reduce human intervention, and improve efficiency.
Active Publication Date: 2020-12-11
SINO IC TECH
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Problems solved by technology
However, since the probe on the tower can move within a certain range, and the needle tip of the probe will be oxidized or adhered to insulating objects when used for a long time, the copper sheet in contact with it on the PCB is a very small plane , and there are a lot of probes on the tower, so in docking in this case, there are often some probes that open the circuit when doing circuit compensation or the compensation value exceeds the normal range and cause the compensation to fail
At this time, it is necessary to disconnect the connection between the PCB and the tower again, manually handle the probes of the PCB or the tower, and then do line compensation again after connecting, and so on, until the PCB and the tower are completely in good contact, because the equipment connected to the tower is very Heavy, it takes a long time to re-dock each time, which is time-consuming and laborious
Method used
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[0019] As shown in the attached figure, make the flat copper sheet into a sunken cone copper, and add a layer of fine sandpaper on the cone surface, so that the copper at the bottom of the cone is exposed. When docking, if the probe on the tower has If there is a slight offset, through the slope of the conical surface and the downward pressure of the tower, the tip of the probe can be brought into contact with the center of the copper sheet corresponding to the PCB, and during the contact process, the tip of the probe can be rubbed against the sandpaper, except Remove oxides, etc. (if any), so that the contact area is larger and the contact is better. Docking in this way can effectively reduce the number of docking, reduce human intervention, and improve efficiency.
[0020] Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvem...
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The invention discloses a probe and PCB contact method, which is characterized in that a PCB is provided with sinking cones made of planar copper pieces, copper at the bottom of each cone is exposed, and the tip of each probe is enabled to be contacted at the center of the corresponding copper piece of the PCB through the inclination of a conical surface and downward pressure of a tower if the probe on the tower deviates when docking is performed. According to the probe and PCB contact method provided by the invention, the tip of each probe can be enabled to be contacted at the center of the corresponding copper piece of the PCB through the inclination of the conical surface and the downward pressure of the tower. In addition, oxides and the like are removed in the contact process through friction of a piece of abrasive paper for each probe tip, thereby enabling the contact area to be larger, and being better in contact. Through docking performed in such a mode, the number of times of docking can be effective reduced, human intervention is reduced, and the efficiency is improved.
Description
technical field [0001] The invention relates to a contact method, in particular to a contact method between a probe and a PCB. Background technique [0002] The purpose of the present invention is to quickly perform line compensation in a docking mode, and avoid line compensation failures caused by poor contact in the docking mode. [0003] In wafer testing, docking is often used to connect different test modules, such as using tower to connect PCB to perform circuit compensation. However, since the probes on the tower can move within a certain range, and the tip of the probe will be oxidized or adhered to insulating objects when used for a long time, the copper sheet in contact with it on the PCB is a very small plane. , and there are a lot of probes on the tower, so in docking in this case, there are often some probes that open circuit when doing circuit compensation or the compensation value exceeds the normal range, which causes the compensation to fail. At this time, ...
Claims
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IPC IPC(8): G01R1/073G01R31/28
CPCG01R1/07307G01R31/2808
Inventor 顾良波祁建华顾春华
Owner SINO IC TECH