Mobile terminal

A mobile terminal, PCB board technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems that affect the user's experience of mobile terminals, complicated calculation processing, etc., and reduce the surface temperature. , The effect of improving heat dissipation efficiency

Inactive Publication Date: 2017-10-13
TP-LINK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the hardware of the mobile terminal is continuously upgraded, and the calculation processing performed by it is also more complicated. The heat dissipation efficiency of the mobile terminal will directly affect the performance of its hardware, thereby affecting the user's experience of the mobile terminal.

Method used

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] see figure 1 , which is a schematic diagram of a mobile terminal provided by an embodiment of the present invention, the mobile terminal includes a display module 1, a middle frame 2, a PCB board 3, and a rear case 4 that are sequentially stacked; the middle frame 2 and the PCB board 3 A heat source element 5 is disposed between them; a heat uniform radiation assembly 6 for radiating the heat generated by the heat source element 5 to the rear case 4 is dispo...

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Abstract

The invention discloses a mobile terminal. The mobile terminal comprises a display module, an intermediate frame, a printed circuit board (PCB) and a rear shell which are sequentially arranged in a lamination way, wherein a heat source piece is arranged between the intermediate frame and the PCB, an uniform heat radiation assembly is arranged between the PCB and the rear shell and is used for radiating heat generated by the heat source piece to the rear shell, the uniform heat radiation assembly has relatively high heat conduction capability and heat radiation capability, the heat generated by the heat source piece is transferred to the uniform heat radiation assembly and then is uniformly dissipated, meanwhile, the uniform heat radiation assembly can be used for effectively radiating the heat to the rear shell, so that the surface temperature of the mobile terminal is reduced, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a mobile terminal. Background technique [0002] With the development of electronic technology, mobile terminals such as mobile phones and tablet computers are gradually becoming thinner and thinner. The distance between the hardware of mobile terminals is getting smaller and smaller, resulting in smaller and smaller heat dissipation space, which affects the heat dissipation efficiency of mobile terminals. At the same time, the hardware of the mobile terminal is continuously upgraded, and the calculation processing performed by it is also more complicated. The heat dissipation efficiency of the mobile terminal will directly affect the performance of the hardware, thereby affecting the user's experience of the mobile terminal. [0003] In order to improve the heat dissipation of mobile terminals, graphite sheets, thermally conductive gels, and thermally conductive silica gels a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20445H05K7/20481
Inventor 刘帆
Owner TP-LINK
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