Soft solder mounting rail unit

A soft solder and rail technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of large amount of hydrogen gas, affecting the safety of the production process, increasing costs, etc., to improve cleanliness and improve cleanliness , the effect of reducing the demand

Inactive Publication Date: 2017-11-03
大连佳峰自动化股份有限公司
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  • Claims
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AI Technical Summary

Problems solved by technology

In the prior art, hydrogen-nitrogen mixed gas is usually directly injected into the high-temperature guide rail. This method consumes a large amount of hydrogen gas, which increases the manufacturing cost. The hydrogen content greatly affects the safety of the production process

Method used

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  • Soft solder mounting rail unit

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] The purpose of the present invention is to provide a soft solder chip loading track unit to solve the problems in the prior art, while ensuring product quality, reduce the gas supply of hydrogen in the production process of semiconductor products, reduce production costs and improve the production process security.

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention wil...

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Abstract

The invention discloses a soft solder mounting rail unit which comprises a rail body and a plasma cleaning machine. A plurality of hydrogen-nitrogen protecting gas connectors are arranged on the two sides of the rail body. The plasma cleaning machine is provided with a plurality of pipelines. The multiple pipelines communicate with the multiple hydrogen-nitrogen protecting gas connectors correspondingly. Through the structural design, the plasma cleaning machine removes contaminants on the surface of a bare copper framework at the station before the mounting procedure, and conducts reduction and deoxidation on the surface of the bare copper framework containing oxidation elements, the cleanliness of the surface of the bare copper framework is improved in the solder mounting process, and the backflow performance of solder is improved. Meanwhile, through the plasma cleaning machine, the cleanliness of the surface of the bare copper framework is improved, then the requisite amount of hydrogen is decreased, the production cost is reduced, and meanwhile, the safety of the production process is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to a soft solder chip loading track unit. Background technique [0002] Plasma cleaners use the properties of active components such as ions, electrons, atoms or active groups to treat the surface of the sample, so as to achieve the purpose of cleaning and coating. During the production of semiconductor products, it is necessary to heat the bare copper frame. During the process, solder wire is used to melt between the chip and the frame, and after cooling, the two are combined. This method of fixing is usually called soft solder mounting. [0003] Since the bare copper frame will be oxidized in the high-temperature guide rail, the general conventional method is to use a hydrogen-nitrogen mixed gas for protection and reduction in the heating track to ensure that the bare copper frame avoids oxidation at high temperature. In the prior art, hydrogen-nitrogen mixed gas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00H01L21/67
CPCB08B7/00H01L21/67028
Inventor 杜绍明王云峰许明鑫梁吉来刘志松孙萌王东明
Owner 大连佳峰自动化股份有限公司
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