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OLED panel, preparation method thereof and OLED device

A display panel and via technology, which is used in semiconductor/solid-state device manufacturing, organic semiconductor devices, electric solid-state devices, etc., can solve the problem of easy falling off of connecting wires, and achieve the effect of improving the binding effect and sticking firmly.

Active Publication Date: 2017-11-07
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the above-mentioned deficiencies existing in the prior art, and provides an OLED display panel and its preparation method, and an OLED display device, which are used to at least partially solve the problem that the connecting wires used to bind the OLED display panel and the FPC are easy to fall off.

Method used

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  • OLED panel, preparation method thereof and OLED device
  • OLED panel, preparation method thereof and OLED device
  • OLED panel, preparation method thereof and OLED device

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Embodiment Construction

[0048] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0049] Such as figure 1 As shown, the present invention provides an OLED display panel, and the OLED display breadboard includes: a base 1, a connecting wire 5, an insulating layer 2, a source-drain electrode layer 3, and a planarization layer (PLN) sequentially arranged on the base 1 4. The insulating layer 2 is provided with a first via hole 6 penetrating through the insulating layer 2 , the source-drain electrode layer 3 covers the first via hole 6 , and the connection line 5 is located i...

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Abstract

The invention provides an OLED panel, a preparation method thereof and an OLED device. A first through hole is formed in an insulating layer and covered with a source and drain electrode layer; a planarization layer is arranged on the insulating layer and the source and drain electrode layer, and a second through hole with the aperture larger than that of the first through hole is formed in the planarization layer, so that the second through hole is communicated with the first through hole, and a first step is formed by the position, at the second through hole, of the planarization layer and the source and drain electrode layer; a connection line is at least located in the first through hole and the second trough hole and at least covers the first step, that is, the connection line is connected with the planarization layer through a first step structure, so that the connection line is not likely to fall off from a through hole area, and attachment of the connection line and the planarization layer is firmer. The binding effect of the OLED panel and an FPC and the stability of signal transmission are improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED display panel, a preparation method thereof, and an OLED display device. Background technique [0002] The OLED display panel is connected to a PCB (Printed Circuit Board, printed circuit board) and connected to the main board by being bound to an FPC (Flexible Printed Circuit, flexible printed circuit board). [0003] In the peripheral area of ​​the OLED display panel, before forming the source pattern and the drain pattern, first form a via hole through the insulating layer, so that the source and drain electrode layer covers the via hole, and then sequentially form a planarization layer, a pixel defining layer, spacer layer, and expose the source-drain electrode layer, and form a connection line in the via hole area, the connection line is electrically connected to the source-drain electrode layer, and is electrically connected to the IC on the FPC, so as to realize O...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/123H10K59/131H10K71/00H10K71/20Y02E10/549H10K59/122H10K77/111H10K59/1201H01L24/29H01L24/32H01L2224/29009H01L2224/29022H01L2224/32225H10K59/124H10K2102/311
Inventor 高永益董向丹
Owner BOE TECH GRP CO LTD