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Aluminum alloy medium and thick plate welding method in semiconductor industry

A welding method and technology of aluminum alloy, applied in welding equipment, metal processing, non-electric welding equipment and other directions, can solve the problems of high machining cost, low precision, difficult processing, etc., to reduce the consumption of raw materials, optimize the structure, and improve the welding efficiency. Effect

Inactive Publication Date: 2017-11-10
SHENYANG FORTUNE PRECISION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantage of adopting a piece of aluminum material for integral machining is waste of material and high machining cost; in the prior art, several plates are processed and formed by internal and external melting welding, which requires multi-layer and multi-pass welding or pre-welding before welding. Heating and other welding problems, not only difficult to process, but also less accurate

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  • Aluminum alloy medium and thick plate welding method in semiconductor industry
  • Aluminum alloy medium and thick plate welding method in semiconductor industry
  • Aluminum alloy medium and thick plate welding method in semiconductor industry

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Embodiment Construction

[0022] A welding technology for high-quality aluminum alloy medium and thick plates in the semiconductor industry. By optimizing the structure of the vacuum chamber in the semiconductor industry, it is split into 4-5 aluminum alloy steel plates, using friction stir welding welding technology, and the joint design makes it It meets the welding requirements of friction stir welding, achieves no gaps on the inner wall of the cavity and meets the requirements of sealing use.

[0023] The purpose of the present invention is achieved through the following technical solutions:

[0024] Split the cavity into 5 aluminum alloy sheets, as shown in Figure 1, including a, b, c, d, e.

[0025] Cavity friction stir welding equipment adopts horizontal or vertical machine tool structure, and each plate of a, b, c, d, e is spliced ​​and formed by positioning tooling in advance. The tooling has sufficient rigidity to meet the welding requirements of friction stir welding.

[0026] For the vacu...

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Abstract

The invention discloses an aluminum alloy medium and thick plate welding method in the semiconductor industry. The method comprises the steps that a friction stir welding technology is adopted for conducting aluminium alloy medium and thick plate welding; for aluminium alloy medium and thick plates with the thickness smaller than 50 mm in the semiconductor industry, a butt joint mode is adopted, the plates are subjected to once external welding to be completely fused, a seamless cavity is formed, and the connector form adopts a straight face or a folded face; for a vacuum cavity with the wall thickness larger than 50 mm in the semiconductor industry, a multi-layer butt joint mode is adopted, after a bottom layer is welded to be fused through once welding, the previous layer is filled with a welding material, the welding material and the aluminium alloy medium and thick plates arranged at the two ends of the previous layer in the semiconductor industry form a straight face or an inclined face, external friction stir welding is conducted to achieve complete fusion, and a seamless cavity is formed. Accordingly, aluminium alloy plates with the thickness exceeding 100 mm can be welded, the machining mode of part of the aluminum alloy cavities in the semiconductor industry are changed into the mode of splicing multiple aluminium alloy plates and then welding the plates to be shaped from the mode of being machined and shaped through a whole material, and raw material consumption is lowered.

Description

Technical field: [0001] The invention relates to the field of welding in the equipment manufacturing industry, in particular to a high-quality aluminum alloy medium and thick plate welding technology in the semiconductor industry, which is suitable for welding aluminum alloy cavities with a plate thickness exceeding 35mm. Background technique: [0002] The wall thickness of the aluminum alloy large cavity in the semiconductor industry is greater than 35mm. In order to ensure its airtightness, some of them are machined and formed by a piece of aluminum material or several plates are formed by internal and external fusion welding. The disadvantage of using a piece of aluminum material for overall machining is waste of material and high machining cost; in the prior art, several plates are used for machining and forming by internal and external melting welding, which requires multi-layer and multi-pass welding or pre-welding before welding. Heating and other welding problems are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/12
CPCB23K20/122B23K20/129B23K2101/185B23K2103/10
Inventor 李生智谯永鹏李文明张维侯涛
Owner SHENYANG FORTUNE PRECISION EQUIP CO LTD