Radiator control method, device and electronic equipment

A technology of electronic equipment and control method, which is applied in the direction of instrumentation, hardware monitoring, electrical digital data processing, etc., can solve the problems affecting the heat dissipation efficiency of electronic equipment and cannot meet the airflow demand of faulty fans, and achieve the effect of avoiding noise and improving heat dissipation efficiency

Active Publication Date: 2021-01-15
LENOVO (BEIJING) LTD
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AI Technical Summary

Problems solved by technology

[0005] In practical applications, when a fan failure is detected, the speed of other fans must be increased to meet the heat dissipation requirements of electronic equipment. However, a large increase in the speed of other fans will generate a lot of noise. Unable to meet the air flow requirements of the effective heat dissipation area corresponding to the faulty fan, which will affect the heat dissipation efficiency of electronic equipment

Method used

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  • Radiator control method, device and electronic equipment
  • Radiator control method, device and electronic equipment
  • Radiator control method, device and electronic equipment

Examples

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Embodiment Construction

[0058]The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0059] In practical applications, for electronic equipment that generates a lot of heat during operation, in order to ensure its working performance, there are usually multiple heat sinks inside the electronic equipment, such as figure 1 The structure shown (this application only uses four radiators as an example for illustration, but is not limited thereto), the corresponding heat dissipation area of ​​each radiator (such as figure 1 S1, S2, S3 and S4) usually have an overlapping ar...

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Abstract

The invention provides a radiator control method and device and an electronic device. When it is monitored that a certain radiator in the electronic device, for example, a first radiator, breaks down, at least one second radiator adjacent to the first radiator in position is determined by utilizing preset position information of multiple radiators, the heat radiating area corresponding to at least one second radiator covers the heat radiating area corresponding to the first radiator by controlling at least one determined second radiator to rotate towards the first radiator, and accordingly the heat radiating demands of electronic elements in the heat radiating area corresponding to the first radiator are met. Thus, it can be seen that heat radiation of the area corresponding to the faulted radiator is achieved by turning the radiator adjacent to the faulted radiator under the situation that heat radiation of the electronic elements in the heat radiating area of the radiator itself is not affected, the heat radiating efficiency of the electronic device is improved without increase of the power of other radiators, and noise production is avoided.

Description

technical field [0001] The present application mainly relates to the field of heat dissipation control, and more specifically relates to a radiator control method, device and electronic equipment. Background technique [0002] With the rapid development of electronic technology, more and more electronic components are integrated in electronic equipment such as desktop computers, notebook computers, various industrial computers, and servers to meet the various functional requirements of users for electronic equipment in life and work. . [0003] During the operation of electronic equipment, a large number of heat-generating electronic components will generate heat, which will cause the temperature of the working environment of electronic equipment to rise, thereby affecting the working performance of electronic equipment, and even causing some electronic components to be damaged due to excessive temperature. Therefore, the heat dissipation of the entire system directly affec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F11/30G06F11/20G06F1/20
CPCG06F1/20G06F11/2033G06F11/3058
Inventor 陈良龙
Owner LENOVO (BEIJING) LTD
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