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Integrated circuits and systems and methods for forming integrated circuits

A technology of integrated circuits and power supplies, applied in circuits, electrical components, electrical solid devices, etc.

Active Publication Date: 2017-11-24
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The miniaturization process also leads to tighter design and manufacturing specifications and reliability challenges

Method used

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  • Integrated circuits and systems and methods for forming integrated circuits
  • Integrated circuits and systems and methods for forming integrated circuits
  • Integrated circuits and systems and methods for forming integrated circuits

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Embodiment Construction

[0022] The following disclosure provides various embodiments or examples for implementing the functionality of the presented subject matter. Specific examples of components, materials, values, steps and / or arrangements, etc. are described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the invention. Other components, materials, values, steps and / or arrangements, etc. are also contemplated. For example, in the description that follows, a first feature formed on or over a second feature may encompass embodiments wherein said first and second features are in direct contact, and may equally encompass embodiments wherein said first and second features are formed in direct contact. An embodiment of another functional part between the second functional part, such that the first and second functional parts do not come into direct contact. In addition, the present invention may repeat reference numerals and / or letters in va...

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Abstract

Embodiments of the present invention disclose a method of forming an integrated circuit. The method includes generating, by a processor, a layout design of the integrated circuit, designing an output integrated circuit based on the layout, and removing a portion of the conductive structure of the integrated circuit to form the first conductive structure and the second conductive structure. Generating a layout design includes generating a standard cell layout having a set of conductive feature layout patterns, placing a standard cell layout along with a power layout pattern according to at least one design standard, and arranging at least one conductive feature layout of the set of conductive features layout patterns The pattern extends in at least one direction to the boundary of the power layout pattern. The power layout pattern includes a cutting member layout pattern. The cutting element layout pattern identifies the location of the removed portion of the conductive structure of the integrated circuit. Embodiments of the present invention also provide an integrated circuit and a system for forming an integrated circuit.

Description

technical field [0001] Embodiments of the present invention relate generally to the field of semiconductors, and more particularly, to integrated circuits and systems and methods of forming integrated circuits. Background technique [0002] More recently, the trend toward miniaturization of integrated circuits has resulted in smaller devices that consume less power but provide more functionality at higher speeds. The miniaturization process also leads to tighter design and manufacturing specifications and reliability challenges. Various electronic design automation (EDA) tools generate, optimize and verify the design of integrated circuits while ensuring that design and manufacturing specifications are met. Contents of the invention [0003] According to one aspect of the present invention, there is provided a method of forming an integrated circuit, the method comprising: generating, by a processor, a layout design of the integrated circuit, wherein generating the layout...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50H01L27/02
CPCH01L27/0207G06F30/392H01L2027/11875G06F30/394H01L23/5226H01L23/5286
Inventor 张丰愿张钧皓陈胜雄黄博祥袁立本
Owner TAIWAN SEMICON MFG CO LTD