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A semiconductor intelligent management system

A management system and semiconductor technology, applied in the field of semiconductor intelligent management system, can solve the problems of complex semiconductor production process, affecting enterprise profit, low production efficiency, etc., achieve easy promotion and use, solve complex production process, and improve work efficiency Effect

Active Publication Date: 2020-06-30
SHENZHEN SHICHUANGYI ELECTRONICS
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  • Abstract
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Problems solved by technology

[0002] With the development of science and technology, the productivity level of existing industries has been greatly improved. However, the semiconductor production process is complicated, there are many workpieces, and the circulation is completely counted by manual, which leads to low production efficiency. However, the demand for semiconductors in the market is considerable. , due to low production efficiency, which affects the profit of the enterprise

Method used

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  • A semiconductor intelligent management system

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Embodiment Construction

[0043] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0044] Such as figure 1 As shown, a semiconductor intelligent management system, the management system includes a DB die-bonding module, a WB bonding module, a MD plastic sealing module, a JS cutting module, and a TS testing module;

[0045] The DB die-bonding module includes sequential processes:

[0046] Cartoning module, the cartoning module uses the control material box to enter the assembly line at fixed intervals;

[0047] A solid main control module, the solid main control module is used to control the die bonding process, which is to fix the main control unit on the substrate;

[0048] A wafer-fixing module, the wafer-fixing module is u...

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Abstract

The invention discloses an intelligent semiconductor management system. The management system comprises a DB die bonding portion module, a WB bonding portion module, a MD plastic package portion module, a JS cutting portion module and a TS test portion module. The intelligent semiconductor management system has the advantages of stable data and clear process, and does not cause data confusion; and besides, if the proceeding process is not finished, the next process cannot be executed, so that a final product can be obtained step by step only after personnel responsible for all processes finish the processing process of the processes.

Description

technical field [0001] The invention relates to an ERP management system, in particular to a semiconductor intelligent management system. Background technique [0002] With the development of science and technology, the productivity level of existing industries has been greatly improved. However, the semiconductor production process is complicated, there are many workpieces, and the circulation is completely counted by manual, which leads to low production efficiency. However, the demand for semiconductors in the market is considerable. , due to low production efficiency, which affects the profitability of the enterprise. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide an intelligent semiconductor management system. [0004] In order to solve the above-mentioned technical problems, the present invention is realized through the following solutions: a semiconductor inte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06Q10/06H01L21/67
CPCG06Q10/06316G06Q10/0633H01L21/67242
Inventor 倪黄忠
Owner SHENZHEN SHICHUANGYI ELECTRONICS
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