Semiconductor package structure

Abstract

The embodiment of the invention provides a semiconductor package structure. The semiconductor package structure comprises semiconductor package comprising a redistribution layer structure, semiconductor particles and multiple conductive structures. The redistribution layer structure comprises a first surface and a second surface. The first surface is opposite to the second surface. The redistribution layer structure also comprises multiple conductive circuits and antenna patterns. The conductive circuits and antenna patterns are adjacent to the first surface and the second surface respectively. The semiconductor particles are arranged on the first surface and are electrically coupled to the redistribution layer structure. The conductive structures are electrically coupled to the redistribution layer structure and are separated from the antenna patterns through first conductive circuits. According to the invention, the antenna patterns are integrated in the redistribution layer structure, so the integration level of the semiconductor package structure can be improved.

Description

technical field [0001] The present invention relates to the field of packaging technology, in particular to a semiconductor packaging structure, wherein the semiconductor packaging structure can be a fan out (fan out) packaging structure with an antenna, and the antenna can be integrated into a single RDL (Redistribution Layer, redistribution layer) structure. Background technique [0002] In order to ensure continued miniaturization and multi-functionality of electronic products and communication equipment, the field desires a semiconductor package that is small in size, supports multi-pin connections, operates at high speed, and has high functionality. In addition, in high frequency applications, such as RF SiP (Radio Frequency System-in-Package, radio frequency system-in-package) components, antennas are generally used to enable wireless communication. [0003] In such a traditional SiP structure, separate antenna elements are individually sealed or mounted on a PCB (Pri...

AI Technical Summary

Problems solved by technology

However, the PCB requires additional area for the antenna elements mounted on it

Thus, it is difficult to reduce the package size

Also, when the antenna element is mounted on the package, it increases the overall height of the SiP structure

In addition, in this case, since the antenna element is generally mounted on the package via an SMT (Surface Mount Technology, Surface Mount Technology) process, poor SMT process control may cause delamination between the antenna element and the underlying package

In this way, the reliability, yield and throughput of the semiconductor packaging structure are reduced

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