Flip chip and flexible substrate packaging structure and method
A flexible substrate and chip technology, used in electrical components, electrical solid devices, circuits, etc., can solve the problem of high cost and achieve the effects of high practicability, reduced packaging costs, and convenient use.
Active Publication Date: 2017-12-01
ARIZON RFID TECH YANGZHOU
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0004] The disadvantages of this approach are as follows: ACP is a thermosetting adhesive mixed with conductive particles with a very uniform particle size, and requires uniform distribution. The cost of this material is very expensive
Method used
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[0029] The present invention will be further explained below in conjunction with the accompanying drawings and the accompanying description.
[0030] A structure for packaging a flip chip and a flexible substrate, including a chip 1 and a flexible substrate 2. On the front of the chip 1, chip circuits, chip circuit contacts, metal contacts 1-1, chip circuits, chip circuit contacts, and metal contacts are arranged 1-1 Forms the chip circuit surface of the chip 1, the front side of the flexible substrate 2 is provided with substrate metal 2-1, the substrate metal 2-1 is provided with substrate wiring and substrate wiring contacts, substrate metal 2-1, substrate wiring, and substrate wiring contacts The substrate circuit surface of the flexible substrate is formed; the chip circuit surface of the chip 1 faces the substrate circuit surface of the flexible substrate 2, and the chip circuit contacts are aligned with the substrate circuit contacts; a non-conductive filler is filled betwe...
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The invention relates to a flip chip and flexible substrate packaging structure and method. The flip chip and flexible substrate packaging structure comprises a chip and a flexible substrate; a chip line, a chip line contact and a metal contact are arranged on the right side of the chip; the chip line, the chip line contact and the metal contact form a chip line face of the chip; a substrate metal is arranged on the right side of the flexible substrate; a substrate line and a substrate line contact are arranged on the substrate metal; the substrate metal, the substrate line and the substrate line contact form a substrate line face of the flexible substrate; the chip line face of the chip faces the substrate line face of the flexible substrate, and the chip line contact is aligned with the substrate line contact; a non-conductive thermosetting adhesive is filled between the chip and the flexible substrate; and the substrate metal of the flexible substrate is embedded into the metal contact of the chip so as to form electrical conduction of the chip line contact and the substrate line contact. By the flip chip and flexible substrate packaging structure and method disclosed by the invention, the insulated thermosetting adhesive is used to replace an anisotropic conductive adhesive, so that chip packaging cost can be greatly reduced.
Description
Technical field [0001] The invention relates to a structure and method for packaging a flip chip and a flexible substrate, and belongs to the technical field of electronic semiconductors. Background technique [0002] The conventional RFID flip-chip package is to bond the circuit surface of the chip toward the metal circuit surface of the antenna, and the contacts on the circuit surface of the chip have gold bumps with a hardness of about 30~120HV, and they are connected between the chip and the antenna. The other is anisotropic conductive adhesive (ACP), which is doped with conductive particles and thermosetting adhesive. During bonding, conductive particles are embedded between the bump and the metal foil of the antenna to form conduction; and the thermosetting glue in the ACP is filled between the chip and the antenna to form a bonding force. [0003] What needs to be understood is that RFID: Radio Frequency Identification; Chip: refers to the unpackaged integrated circuit (IC)...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/31H01L23/482H01L21/56H01L23/29
CPCH01L23/3121H01L21/56H01L23/293H01L23/482
Inventor 李宗庭陈萌
Owner ARIZON RFID TECH YANGZHOU