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Power amplifier

A technology for power amplifiers and PCB boards, which is applied to stackable modules, electrical equipment structural parts, electrical components, etc., can solve problems such as higher requirements for connectors, increased labor costs, and wrong plugging, and achieve prevention Good interference and safety, reduced PCB area, and large isolation distance

Pending Publication Date: 2017-12-01
天工(广州)音响设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present invention discloses a power amplifier. The first layer PCB board with high-voltage circuit and the second layer PCB board with low-voltage circuit are designed as a double-layer structure and connected by conductive studs, which abandons the existing The flying wire connection method, the conductive stud can not only conduct electricity, but also play a supporting role, which solves the problem of high cost and the need for two Subsequent manual assembly will increase labor costs, and it is prone to misconnection, which will cause serious consequences. Due to the high transmission power, the requirements for connectors are high, and after long-term use, it is easy to have poor contact and even heat, sparks, fires, etc. technical problems with serious consequences

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Embodiment Construction

[0038] The embodiment of the present invention discloses a power amplifier. The first layer of PCB board 2 provided with high-voltage circuits and the second layer of PCB board 1 provided with low-voltage circuits are designed as double layers and connected by conductive studs 3. In some flying wire connection methods, the conductive stud 3 can not only conduct electricity, but also play a supporting role, which solves the high cost of using the flying wire connection method between the high-voltage circuit and the low-voltage circuit in the existing power amplifier. , Requires secondary manual assembly to increase labor costs, prone to misconnection and cause serious consequences, due to high transmission power, high requirements for connectors and after long-term use, it is prone to poor contact and even heat, ignition, and fire And other technical problems with more serious consequences.

[0039] see figure 1 , an embodiment of a power amplifier provided in the embodiment ...

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Abstract

The embodiment of the invention discloses a power amplifier; a first layer PCB plate with a high voltage circuit and a second PCB plate with a low voltage circuit are designed in a dual-layer structure and connected through a conductive stud, thus abandoning an existing fly line connecting mode; the conductive stud can provide conductive and support effects, thus solving the following technical problems: the high voltage circuit and low voltage circuit of an existing power amplifier are connected in the fly line mode, so the cost is high; second time artificial assembly is needed so as to increase labor cost, and plug errors easily happen, thus causing severe results; a needed transmission power is large, so high requirements are set on plug members, and severe results like poor contacts, heating, sparking and burning may happen after long time usage.

Description

technical field [0001] The invention relates to the field of power amplifiers, in particular to a power amplifier. Background technique [0002] Power amplifier (English name: power amplifier), referred to as "power amplifier", refers to an amplifier that can generate maximum power output to drive a certain load (such as a speaker) under a given distortion rate. The power amplifier plays a pivotal role in the "organization and coordination" of the entire audio system, and to some extent determines whether the entire system can provide good sound quality output. [0003] Because in the power amplifier, high-voltage circuits and low-voltage circuits coexist and are interleaved with each other. In order to isolate the high-voltage circuit from the low-voltage circuit and avoid interference to the low-voltage circuit, the existing power amplifier can only solve this contradiction by means of external flying wires, that is, to separate the high-voltage circuit from the power sup...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K7/20H05K7/02H01R12/52
CPCH01R12/52H05K1/144H05K7/023H05K7/20145
Inventor 谢良洪详勇
Owner 天工(广州)音响设备有限公司