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Silicon rod cutting guide device

A technology of guiding devices and silicon rods, which is applied in the direction of fine working devices, working accessories, stone processing equipment, etc., can solve problems such as roughness and large loss of cutting surfaces, achieve uniform thickness, increase yield, and improve cutting efficiency.

Active Publication Date: 2017-12-12
仪征市恒达钢结构有限公司如皋分公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when cutting the silicon rod by moving the cutter on the cutting surface of the solar mono-silicon rod, the control of the cutter is mostly based on the operator's experience, which results in a large loss of the cutting surface and is relatively rough

Method used

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  • Silicon rod cutting guide device
  • Silicon rod cutting guide device
  • Silicon rod cutting guide device

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] see Figure 1-3 , in an embodiment of the present invention, a silicon rod cutting guiding device includes a guiding device work surface 1, a clamp 2, a finished product collection tank 5, a sliding table 7, a walking frame installation chute 12 and a walking frame 13, and the guiding device works The middle surface of one side of the table top 1 is provided with a walking frame installation chute 12, the upper part of the walking frame installation chu...

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PUM

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Abstract

The invention discloses a silicon rod cutting guide device which comprises a guide device working tabletop, a fixture, a finished product collecting groove, a slide table, a travel frame mounting slide groove and a travel frame. The travel frame mounting slide groove is formed in the middle surface of one side of the guide device working tabletop, the travel frame is mounted on the upper portion of the travel frame mounting slide groove, a slide table mounting groove is formed in the surface of the other side of the guide device working tabletop, the slide table is mounted on the upper portion of the slide table mounting groove, a chuck fixing seat is welded on one side of the upper portion of the travel frame, a travel frame driving motor is mounted on the other side of the upper portion of the travel frame, and a three-jaw chuck mounting groove is formed in the upper portion of the chuck fixing seat. The silicon rod cutting guide device has the advantages that silicon rods can be automatically fed by the silicon rod cutting guide device, and each cut silicon wafer has a uniform thickness; the thicknesses of the silicon wafers can be adjusted as needed, the silicon rod cutting efficiency can be effectively improved, and the yield of the silicon wafers can be increased.

Description

technical field [0001] The invention relates to the technical field of cutting guide devices, in particular to a silicon rod cutting guide device. Background technique [0002] Monocrystalline silicon is a crystal with a substantially complete lattice structure. Different directions have different properties, and it is a good semiconducting material. The purity requirement reaches 99.9999%, or even more than 99.9999999%. Used in the manufacture of semiconductor devices, solar cells, etc. It is drawn from high-purity polysilicon in a single crystal furnace. [0003] At present, when the silicon rod is cut by moving the cutter on the cutting surface of the solar mono-silicon rod, the control of the cutter is mostly based on the operator's experience, resulting in a large loss and roughness of the cutting surface. Especially the problem that the tool is easy to form uneven thickness of the silicon rod when it is fed into the knife. Contents of the invention [0004] The ...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D7/04
CPCB28D5/0058B28D5/0082
Inventor 吕伟南
Owner 仪征市恒达钢结构有限公司如皋分公司