Unlock instant, AI-driven research and patent intelligence for your innovation.

An integrated circuit board drying device

A technology for integrated circuit boards and drying devices, applied in drying, drying machines, heating devices, etc., can solve the problem that integrated circuits cannot be increased or reduced at any time, so as to reduce the drying force Effect

Active Publication Date: 2021-12-10
湖南日进智能科技有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the shortcomings in the prior art that the integrated circuit cannot be dried in rotation, the drying force cannot be increased or decreased at any time, and the drying force cannot be moved at any time following the change of the working place, the technical problem to be solved by the present invention is to provide An integrated circuit board drying device that can dry integrated circuits in a rotating manner, can increase or decrease the drying force at any time, and can move at any time following changes in the working place

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An integrated circuit board drying device
  • An integrated circuit board drying device
  • An integrated circuit board drying device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Integrated circuit board drying device, such as Figure 1-7 As shown, it includes a bottom plate 1 , a fixing mechanism 2 and a drying mechanism 3 , the drying mechanism 3 is connected to the top left side of the bottom plate 1 , and the fixing mechanism 2 is connected to the top right side of the bottom plate 1 .

Embodiment 2

[0037] Integrated circuit board drying device, such as Figure 1-7 As shown, it includes a bottom plate 1 , a fixing mechanism 2 and a drying mechanism 3 , the drying mechanism 3 is connected to the top left side of the bottom plate 1 , and the fixing mechanism 2 is connected to the top right side of the bottom plate 1 .

[0038] The fixing mechanism 2 includes a first slide rail 201, a first stopper 202, a first slide block 203, a spring 204, a second slide rail 205, a first fixed rod 206, a second slide block 207, a clamp rod 208 and a rubber block 209, a first slide rail 201 is connected to the right side of the top of the bottom plate 1, a first slide block 203 is slidably connected to the first slide rail 201, and a first stopper 202 is connected to the middle part of the front wall of the first slide rail 201. A spring 204 is connected between the block 202 and the first slide block 203. The left side of the first slide block 203 and the lower side of the left wall of th...

Embodiment 3

[0040] Integrated circuit board drying device, such as Figure 1-7 As shown, it includes a bottom plate 1 , a fixing mechanism 2 and a drying mechanism 3 , the drying mechanism 3 is connected to the top left side of the bottom plate 1 , and the fixing mechanism 2 is connected to the top right side of the bottom plate 1 .

[0041] The fixing mechanism 2 includes a first slide rail 201, a first stopper 202, a first slide block 203, a spring 204, a second slide rail 205, a first fixed rod 206, a second slide block 207, a clamp rod 208 and a rubber block 209, a first slide rail 201 is connected to the right side of the top of the bottom plate 1, a first slide block 203 is slidably connected to the first slide rail 201, and a first stopper 202 is connected to the middle part of the front wall of the first slide rail 201. A spring 204 is connected between the block 202 and the first slide block 203. The left side of the first slide block 203 and the lower side of the left wall of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a drying device, in particular to an integrated circuit board drying device. The technical problem to be solved by the present invention is to provide an integrated circuit board drying device that can dry integrated circuits in rotation, increase or decrease the drying force at any time, and move at any time following changes in the working place. In order to solve the above technical problems, the present invention provides such an integrated circuit board drying device, which includes a bottom plate, etc.; a drying mechanism is connected to the top left side of the bottom plate, and a fixing mechanism is connected to the top right side of the bottom plate. The present invention designs an integrated circuit board drying device. The rubber block is arranged so that the circuit elements on the surface of the integrated circuit board will not be damaged when the integrated circuit board is clamped. The drying lamp provided can accelerate the moisture drying on the surface of the integrated circuit board. Drying, so that the water in the components can also be dried, to achieve the effect of drying the integrated circuit in a rotating manner, increasing or decreasing the drying intensity at any time, and moving at any time with the change of the working place.

Description

technical field [0001] The invention relates to a drying device, in particular to an integrated circuit board drying device. Background technique [0002] An integrated circuit board is a carrier for carrying integrated circuits. But it is often said that the integrated circuit board also brings the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. [0003] Drying refers to the process of removing the solvent to retain the solid content in some way. Usually refers to the process of passing hot air to evaporate and take away the moisture in the material. [0004] Before assembly, circuit board assembly manufacturers usually dry the PCB to prevent poor soldering due to moisture, but often ignore the moisture of components such as integrated circuits. The thermal solid material used in integrated circuit packaging seems to be moisture-proof, but the actual situation is just the opposite, so the drying of integrated ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F26B9/04F26B9/10F26B21/00F26B23/04F26B25/00
CPCF26B9/04F26B9/10F26B21/004F26B23/04F26B25/00
Inventor 周晓东张健刘超群阳冬
Owner 湖南日进智能科技有限公司