Grinding pad finisher and grinding pad finishing method

A technology for grinding pads and dressers, which is applied to the parts of grinding machine tools, grinding/polishing equipment, abrasive surface adjustment devices, etc., can solve the problems of unsatisfactory dressing effect of grinding pads and complex structure of grinding pad dressers, etc., to achieve Improve the grinding effect, easy to implement, and simplify the structure

Active Publication Date: 2017-12-15
SEMICON MFG INT TIANJIN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of grinding pad dresser and grinding pad dressing method, to solve one or more problems in the prior art such as unsatisfactory grinding pad dressing effect and complicated structure of the grinding pad dresser

Method used

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  • Grinding pad finisher and grinding pad finishing method
  • Grinding pad finisher and grinding pad finishing method
  • Grinding pad finisher and grinding pad finishing method

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Embodiment Construction

[0045] The inventors have studied the prior art and found that in most cases, the unstable dressing pressure of the dressing disc is the most important reason for the low material removal rate and poor flatness of the grinding pad. In order to solve the problem of unsatisfactory dressing effect of the polishing pad in the prior art, the present invention provides a polishing pad dresser and a polishing pad dressing method.

[0046] The invention provides a polishing pad dresser, which is used in the wafer manufacturing process to dress a polishing pad so that the surface of the polishing pad is flattened, which includes:

[0047] a dressing disc for dressing a grinding pad;

[0048] a fluid pressure driving unit, connected to the trimming disc, and used to drive the trimming disc to move through fluid power;

[0049] A control unit, connected to the fluid pressure driving unit, used to control the fluid pressure driving unit to drive the conditioning disc to press against the...

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Abstract

The invention provides a grinding pad finisher and a grinding pad finishing method. The grinding pad finisher comprises a finishing disc, a fluid pressure driving unit, a detecting unit and a control unit; the finishing disc is used for finishing a grinding pad; the fluid pressure driving unit is connected with the finishing disc for driving the finishing disc to move through fluid power; the control unit is connected with the fluid pressure driving unit for controlling the fluid pressure driving unit to drive the finishing disc to butt against and finish the grinding pad according to preset working parameters; the detecting unit is connected with the fluid pressure driving unit and the control unit for obtaining actual working parameters of the fluid pressure driving unit and feeding the actual working parameters back to the control unit; the control unit judges whether the finishing disc works under preset finishing pressure or not according to the actual working parameters; and if the pressure exceeds the preset finishing pressure, the control unit gives out an alarm. The grinding pad finisher simplifies the driving structure, and can prevent finishing of the grinding pad beyond the preset finishing pressure to guarantee the pressure stability.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a polishing pad dresser and a polishing pad dressing method. Background technique [0002] During wafer fabrication, wafers are ground and polished to flatten their surfaces. Currently, the grinding and polishing of the wafer is accomplished by a chemical mechanical polishing (CMP, Chemical Mechanical Polishing) device. The existing CMP apparatus 10 includes at least one grinding head for absorbing the wafer, and the grinding head rotates relative to the grinding pad during the grinding process to grind and polish the wafer. [0003] Since the CMP process is to contact the surface of the wafer with the grinding surface of the polishing pad, then, the surface of the wafer is planarized by the relative movement between the surface of the wafer and the grinding surface of the polishing pad. Therefore, the flatness of the polishing surface of the polishing pad is crucial to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017B24B53/12
CPCB24B53/017B24B53/12
Inventor 唐强
Owner SEMICON MFG INT TIANJIN
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