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Double-surface grinding machine for cylindrical wafer

A double-sided grinding and cylindrical crystal technology, which is applied in the direction of grinding machine tools, grinding devices, working carriers, etc., can solve the problems of unfavorable production, increased production costs, and low utilization of star wheels, so as to improve versatility and facilitate production and processing Effect

Pending Publication Date: 2017-12-22
德清凯晶光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The opening position of the traditional star wheel is fixed, so that the same star wheel can only be clamped for the crystal of the same shape, resulting in low utilization rate of the star wheel and increased production cost
For example, the authorized announcement number is CN202804917U, which discloses a star wheel for grinding quartz wafers, which can only process wafers of a fixed size. If other sizes of wafers need to be processed, the star wheel must be replaced, which is not conducive to Production

Method used

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  • Double-surface grinding machine for cylindrical wafer
  • Double-surface grinding machine for cylindrical wafer
  • Double-surface grinding machine for cylindrical wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] according to Figure 1 to Figure 6 As shown, a double-sided grinding machine for cylindrical wafers includes: a base table 1, an upper pressing table 2 and a planetary wheel 3, a grinding chamber 11 is provided on the top of the base table 1, and internal teeth are provided on the outer ring of the grinding chamber 11 Gear 12, the bottom of grinding chamber 11 is provided with bottom grinding sheet 13, and the center of grinding chamber 11 is provided with driving gear 14, and upper pressing table 2 comprises, center driving disc 21, driving motor 22 and upper grinding sheet 23, driving motor 22 and center drive The discs 21 are connected, the central drive disc 21 is assembled with the drive gear 14, the upstream star wheel 3 in the plane direction is arranged between the drive gear 14 and the internal gear 12, and the upstream star wheel 3 in the height direction is arranged on the upper grinding plate 23 and the bottom grinding plate between 13; the planetary wheel 3...

Embodiment 2

[0035] The difference from the above-mentioned embodiment 1 is that, according to Figure 8 As shown, the end of the diameter adjusting rod 3112 away from the hinged fixed end 31121 is provided with a movable chuck 31123, the movable chuck 31123 is hingedly connected with the diameter adjusting rod 3112, and the movable chuck 31123 is C-shaped.

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Abstract

The invention relates to the field of wafer grinding, specifically to a double-surface grinding machine for a cylindrical wafer. The double-surface grinding machine for the cylindrical wafer comprises a pedestal platform, an upper pressing platform and a wandering star wheel; a grinding cavity is formed at the top of the pedestal platform; an inner gear is arranged on an outer ring of the grinding cavity; a bottom grinding sheet is arranged at the bottom of the grinding cavity; a driving gear is arranged in the center of the grinding cavity; the upper pressing platform comprises a central driving disk, a driving motor and an upper grinding sheet; the driving motor is connected with the central driving disk; the central driving disk and the driving gear are assembled; in the plane direction, the wandering star wheel is arranged between the driving gear and the inner gear; in the height direction, the wandering star wheel is arranged between the upper grinding sheet and the bottom grinding sheet.

Description

technical field [0001] The invention relates to the field of wafer grinding, in particular to a double-sided grinding machine for cylindrical wafers. Background technique [0002] In the production process of optical wafers, the grinding process is a very important link. Among them, the double-sided grinding machine is mainly used for double-sided grinding of crystal parts with two parallel sides, and the crystal is clamped by a star wheel. The opening position of the traditional star wheel is fixed, so that the same star wheel can only clamp the crystal of the same shape, resulting in low utilization rate of the star wheel and increased production cost. For example, the authorized announcement number is CN202804917U, which discloses a star wheel for grinding quartz wafers, which can only process wafers of a fixed size. If other sizes of wafers need to be processed, the star wheel must be replaced, which is not conducive to Production. Contents of the invention [0003]...

Claims

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Application Information

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IPC IPC(8): B24B37/08B24B37/28
CPCB24B37/08B24B37/28
Inventor 沈斌斌
Owner 德清凯晶光电科技有限公司
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