LED chip defect automatic detection equipment and method based on X rays

Abstract

The invention discloses LED chip defect automatic detection equipment based on X rays. The LED chip defect automatic detection equipment comprises an X ray detection main body and a shielding shell, wherein the X ray detection main body comprises an X ray source, a detector, a chip clamp, a movable platform and a control system; a chip to be detected on an objective table is irradiated by X rays generated by the X ray source, the detector is used for detecting the X rays penetrating through the chip to be detected, the chip clamp can be located on the objective table in a breakaway mode, the chip clamp is provided with a plurality of chip grooves, the movable platform is configured to achieve movement in the X direction, the Y direction and the Z direction on the objective table, and the control system is configured to obtain position coordinates of the movable platform in real time and can drive the movable platform according to certain paths. The invention further provides an LED chip defect automatic detection method based on the X rays. The LED chip defect automatic detection equipment disclosed by the invention can present defects hidden in the chips in images and achieves quick, nondestructive and automatic batch detection on the LED chips by automatically recognizing and extracting defect parts.

Description

technical field [0001] The invention relates to the field of X-ray automatic detection. More specifically, the present invention relates to an X-ray-based automatic detection device and method for LED chip defects. Background technique [0002] Under the current global development trend of energy saving, emission reduction, low-carbon and environmental protection, LED light sources are rapidly replacing traditional lighting sources with high power consumption, high pollution, and low light efficiency. As a new solid-state light source, high-power LED not only has the function of vision (illumination), but also has the characteristics of wavelength (spectrum) and energy, and has broad application prospects in many special fields. The failure modes of high-power LED devices mainly include electrical failure (such as short circuit or open circuit), optical failure, optical performance degradation caused by insufficient heat dissipation, and mechanical failure (such as lead bre...

AI Technical Summary

Problems solved by technology

[0003] Traditional X-ray inspection systems are often general-purpose equipment, which cannot meet the LED chip inspection requirements in some indicators

Secondly, for batch chip detection, traditional X-ray equipment often needs manual adjustment due to the lack of automatic detection methods, which is time-consuming and laborious, and lacks a convenient and fast method to achieve fast chip detection

Thirdly, due to the lack of corresponding processing software, the welding defects of LED chips can only be judged by human eyes at present, while manual judgment has strong subjectivity, poor repeatability and accuracy, and it is time-consuming and lacks objective standards.

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