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Radiating method for LED with high overall structural strength

A technology of overall structure and heat dissipation method, applied in the cooling/heating device of lighting device, lighting and heating equipment, components of lighting device, etc. The effect of sealing and good heat dissipation

Inactive Publication Date: 2017-12-26
杨航杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a heat dissipation method for LEDs with high overall structural strength, which solves the problem of low overall structural strength of existing LED tri-proof lights

Method used

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  • Radiating method for LED with high overall structural strength

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Embodiment Construction

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0023] like figure 1 As shown, the present invention provides a technical solution: comprising a heat dissipation box (7), the interior of the heat dissipation box (7) is hollow, and the left and right ends of the heat dissipation box (7) are openly arranged, and the left and right ends of the heat dissipation box (7) are open. The clamping blocks (10) are all clamped together, ventilation holes are opened on the sides of the two clam...

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Abstract

The invention discloses a method for dissipating heat from LEDs with high overall structural strength, which comprises a heat dissipation box, the interior of the heat dissipation box is hollow, and the left and right ends of the heat dissipation box are open, and the left and right ends of the heat dissipation box are both clamped with clips. There are ventilation holes on the sides of the two blocks, and dust-proof nets are installed on the ventilation holes of the two blocks, and a through groove is opened on the lower surface of the cooling box, and the through groove is connected with the heat conduction plate, and the fan works so that the outside The air enters the heat dissipation box through the dust-proof net to dissipate heat from the radiator, which improves the heat dissipation of the LED tri-proof light with high overall structural strength. The dust-proof net removes dust from the air entering the heat dissipation box to prevent dust on the radiator Accumulation improves the stability of the radiator. When the temperature in the radiator box exceeds the set value, the bimetal sheet temperature control switch guides the fan to work. The structure is simple and the reliability is high. The reinforcement clip improves the overall structural strength of the radiator box .

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to a heat dissipation method for LEDs with high overall structural strength. Background technique [0002] LED tri-proof light is a kind of LED, which has waterproof, dustproof and anti-corrosion effects. Common LED lights are generally long strips, and long strip LED lights are prone to deformation and fracture, resulting in a reduction in the service life of the entire LED light. SUMMARY OF THE INVENTION [0003] (1) Technical problems solved [0004] In view of the deficiencies of the prior art, the present invention provides a heat dissipation method for an LED with high overall structural strength, which solves the problem of low overall structural strength of the existing LED tri-proof lamp. [0005] (2) Technical solutions [0006] In order to achieve the above object, the present invention provides the following technical solutions: a heat dissipation method for an LE...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/04F21V17/12F21V19/00F21V23/00F21V29/61F21V29/67F21V29/71F21V29/83F21V29/87F21V31/00C09D1/00C09D7/12F21Y115/10
CPCF21S8/04C09D1/00F21V17/12F21V19/001F21V23/003F21V29/61F21V29/67F21V29/71F21V29/83F21V29/87F21V31/005F21Y2115/10
Inventor 杨航杰
Owner 杨航杰
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