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LED (light-emitting diode) appliance and its manufacturing method

A technology of LED devices and manufacturing methods, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of large size of LEDs and the inability to realize the anti-static function of LED devices, and achieve the effect of miniaturization of the installation area and improvement of light output efficiency

Pending Publication Date: 2017-12-26
APT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this light-emitting diode, the LED chip and the Zener diode are installed in adjacent positions, and the total area of ​​the LED chip and the Zener diode becomes the overall component installation area, which leads to a large LED volume; in addition, the existing The installation area of ​​the LED package carrier is as follows: figure 1 As shown, after the LED chip is placed in the installation area of ​​the reflector cup, there is no space for bonding wires. Therefore, this invention patent cannot realize the anti-static function of the LED device under the existing LED packaging carrier

Method used

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  • LED (light-emitting diode) appliance and its manufacturing method
  • LED (light-emitting diode) appliance and its manufacturing method
  • LED (light-emitting diode) appliance and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as figure 2 As shown, it is an LED device 1 according to Embodiment 1 of the present invention, including: a first electrode 11 and a second electrode 12 connected by an insulating colloid 13, the first electrode 11 and the second electrode 12 constitute a support bottom plate, and the support bottom plate Surrounded by a reflective cup 14, the reflective cup 14 is made of white plastic; an LED chip 15 is installed on the first electrode 11, the positive terminal of the LED chip 15 is electrically connected to the first electrode 11, and the negative terminal of the LED chip 15 It is electrically connected with the second electrode 12; a groove 16 is provided on the upper surface of any electrode in the first electrode 11 and the second electrode 12, and a Zener diode 161 is installed in the groove 16; Wherein, the Zener diode 161 and The LED chips 15 are connected in parallel; the groove 16 is filled with reflective colloid 162, the reflective colloid 162 covers ...

Embodiment 2

[0051] Embodiment 2 of the present invention is improved on the basis of the technical solution involved in Embodiment 1: the Zener diode is a vertical Zener diode, one end of the vertical Zener diode is electrically connected to the bottom of the groove through a conductive colloid, and the vertical The other end of the type Zener diode is connected to the other electrode of the first electrode and the second electrode through a wire. Specifically, the zener diode may be a unidirectional zener diode or a bi-phase zener diode. The LED chip is a front-mounted LED chip or a vertical LED chip.

[0052] Next, the embodiment will be described in detail by taking the zener diode as a vertical unidirectional zener diode, the LED chip as a front-mounted LED chip, and the groove disposed on the first electrode as an example. Since the configuration of the bi-phase zener diode is similar to that of the unidirectional zener diode, it will not be listed here.

[0053] Such as image 3 ...

Embodiment 3

[0057] The present invention also provides a method for manufacturing an LED device, comprising the following steps:

[0058] S1. Etching the metal copper sheet into a first electrode and a second electrode;

[0059] S2. Making a groove on the upper surface of any one of the first electrode and the second electrode by using an etching process or a stamping process;

[0060] S3. Using a mold injection molding process, filling insulating colloid between the first electrode and the second electrode to form a support bottom plate, and making reflective cups around the support bottom plate;

[0061] S4. Install the LED chip on the first electrode; wherein, the positive end of the LED chip is electrically connected to the first electrode, and the negative end of the LED chip is electrically connected to the second electrode;

[0062] S5. Install the Zener diode in the groove, connect the Zener diode and the LED chip in parallel, and the height of the Zener diode is lower than the g...

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Abstract

The invention discloses an LED (light-emitting diode) appliance. The LED appliance comprises a first electrode and a second electrode which are connected through an insulation rubber body; the first electrode and the second electrode are formed to be a bracket bottom plate, light reflecting cups are encircled at four sides of the bracket bottom plate; an LED chip is installed on the first electrode; a groove is arranged on the upper surface of any one electrode of the first electrode and the second electrode, and a voltage-regulator diode is installed in the groove; a reflecting rubber layer fills in the groove and covers the voltage-regulator diode, and height of the voltage-regulator diode is lower than that of the groove; a light converting layer fills in the light reflecting cups, and covers the LED chip. The invention further discloses a manufacturing method of the LED appliance. The LED appliance and the manufacturing method of the LED appliance have the advantages of mounting the voltage-regulator diode in an installing zone of a small light reflecting zone, guaranteeing that the LED appliance has the anti-static protection function while improving the lighting efficiency of the LED appliance.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED device and a manufacturing method thereof. Background technique [0002] Since LED devices are electrostatic sensitive devices, they are easily damaged by static electricity or high-voltage surges during use. Therefore, in order to prevent damage to LED devices caused by static electricity and high-voltage surges, the existing LED devices are packaged The general practice in the process is to connect a Zener diode in parallel at both ends of the LED chip. However, because Zener diodes are silicon-based doped diodes, they will absorb the light emitted by the LED chip, resulting in a decrease in the brightness of the LED device. [0003] In order to prevent the Zener diode from absorbing the light emitted by the LED chip, measures to prevent the Zener diode from absorbing light have been proposed. For example, the invention patent CN100543985C proposes a high-brightness light...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/62H01L33/56
CPCH01L33/56H01L33/60H01L33/62
Inventor 侯宇万垂铭余亮朱文敏李真真姜志荣曾照明
Owner APT ELECTRONICS