Heating chamber and semiconductor processing apparatus

A heating cavity and heated technology, which is applied in semiconductor/solid-state device manufacturing, metal material coating process, ion implantation plating, etc., can solve the problem of increasing the temperature difference between the edge region and the center region of the base 11, reducing heating Uniformity and other issues to achieve the effect of improving process uniformity, reducing temperature difference, and improving heating uniformity
CN107546147AInactive Publication Date: 2018-01-05BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Publication Date
2018-01-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a heating chamber and a semiconductor processing apparatus. The heating chamber includes a heating device and a heat insulating member. The heating device includes a base, a connecting cylinder, and a fixing base. The base is configured to support a heated member. A heating element is arranged in the base; the connecting cylinder is respectively connected with the base and the fixing base, and is located in the central area of the base; and the fixing base is connected with the wall of the bottom chamber of the heating chamber. The heat insulating element is arranged between the fixing base and the wall of the bottom chamber to cut off the heat transfer between them. The present invention provides the heating chamber that can reduce the temperature differencebetween the edge region and the central region of the base so that the uniformity of heating can be improved.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor equipment manufacturing, in particular to a heating chamber and semiconductor processing equipment. Background technique

[0002] Physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) technology is a commonly used processing technology in the field of microelectronics, for example, it is used to process copper interconnect layers in integrated circuits. The production of copper interconnection layer mainly includes the steps of degassing, pre-cleaning, Ta(N) deposition, and Cu deposition. The degassing step is to remove water vapor and other volatile impurities on the substrate and other processed workpieces. When implementing the degassing step, it is necessary to put the processed workpiece such as the substrate into the heating chamber and heat it to a certain temperature of 230-350°C.

[0003] figure 1 It is a cross-sectional view of an existing heating ...

Claims

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