Semiconductor laser cutting device

Abstract

The present invention relates to the technical field of semiconductor cutting attachments, in particular to a semiconductor laser cutting device, which can improve its stability during the cutting process of its parts and make its cutting accuracy higher; and when the parts are cooled, it can be conveniently Observe its cooling process to improve its practicability; and the cutting position of the cutting head can be adjusted to reduce its cutting limitations; including support plate, top plate, bottom plate, left side plate, right side plate, four sets of brackets, electric telescopic rod And the cutting head, also includes the cooling box, the pick-and-place port is provided with a cover; also includes four sets of support blocks, four sets of threaded pipes, four sets of threaded rods, four sets of pressing plates, four sets of extrusion spring sets and four sets of pressing blocks ; There is a transparent baffle at the observation hole, which also includes a drive shaft, a rotating shaft, a driving shaft, bristles and a sealing ring; it also includes a slide bar and a slide block, and slide bars are arranged on the front and rear sides of the left side plate and the right side plate. The slot is provided with control keys on the front side wall of the bottom plate.

Description

technical field [0001] The invention relates to the technical field of semiconductor cutting attachments, in particular to a semiconductor laser cutting device. Background technique [0002] As we all know, the semiconductor laser cutting device is an auxiliary device used in the process of parts processing to cut semiconductor lasers so that it can work better. It has been widely used in the field of parts processing; now Some semiconductor laser cutting devices include a support plate, a top plate, a bottom plate, a left side plate, a right side plate, four sets of brackets, an electric telescopic rod and a cutting head. The right side is connected, the bottom ends of the left side board and the right side board are connected with the top of the bottom board, the tops of the four sets of brackets are respectively installed on the left front side, the right front side, the left rear side and the right rear side of the bottom of the support board, the four sets of brackets ...

AI Technical Summary

Problems solved by technology

[0002] As we all know, the semiconductor laser cutting device is an auxiliary device used in the process of parts processing to cut semiconductor lasers so that it can work better. It has been widely used in the field of parts processing; now Some semiconductor laser cutting devices include a support plate, a top plate, a bottom plate, a left side plate, a right side plate, four sets of brackets, an electric telescopic rod and a cutting head. The right side is connected, the bottom ends of the left side board and the right side board are connected with the top of the bottom board, the tops of the four sets of brackets are respectively installed on the left front side, the right front side, the left rear side and the right rear side of the bottom of the support board, the four sets of brackets The bottom end is installed on the top of the bottom plate, the electric telescopic rod is installed at the bottom of the top plate, the output end of the bottom of the electric telescopic rod is connected with the cutting head, and the cooling box is installed on the bottom plate, and the cooling box is located on the right side of the support plate. There is a cooling cavity inside, and the top of the cooling box is connected with a pick-and-place opening, and a cover is set at the pick-and-place opening; when the existing semiconductor laser cutting device is used, the parts are placed on the support plate, and the electric telescopic rod Drive the cutting head at the output end of the bottom to cut it, and import the cut parts into the cooling box filled with coolant; it is found in the use of the existing semiconductor laser cutting device that the cutting process of its parts is stable. Poor performance, resulting in low cutting accuracy; and when the parts are cooling, the cooling process cannot be observed conveniently, resulting in poor practicability; and the cutting position of the cutting head is fixed, resulting in high cutting limitations

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