Method for preparing microwave solid-state circuit corrosion-resistant liquid-cooled cold plate

Abstract

The invention discloses a method for manufacturing a microwave solid circuit corrosion-resistant liquid-cooling cold plate, and aims to provide a manufacture method for the cold plate which is simpleand compact in structure, high in reliability and high in corrosion-resistance. The manufacture method is realized through the following technical scheme: magnetic ring pipes are arranged on an electrode in a sleeve manner; a cold plate casting mould is manufactured according to a cold plate design document; the electrode provided with the magnetic ring pipes in the sleeve manner is pre-buried inthe cold plate forming mould; ends of the conductive electrode are fixed, and then cold plate casting and demoulding are performed, so that the cold plate in which the electrode provided with the magnetic ring pipes in the sleeve manner is buried in advance is obtained; then the electrode provided with the magnetic ring pipes in the sleeve manner is connected with a micro-arc oxidation system to form a conductive loop, and the outer surface and an internal flowing passage of the cold plate are subjected to micro-arc oxidation surface protection treatment through electrification; micro-arc discharging is performed on the surface of the cold plate workpiece and the surface of the internal flowing passage to form micro-arc oxidation layers; after micro-arc oxidation is finished, the electrodeprovided with the magnetic ring pipes in the sleeve manner is drawn out from a cold plate flowing passage opening, so that the high-corrosion-resistant cold plate and the flowing passage in which theinner wall surface of the cold plate flowing passage and the outer surface of the cold plate are both micro-arc oxidized are obtained.

Description

technical field [0001] The invention relates to a method for preparing a liquid-cooled cold plate widely used in electronic equipment with high power and high heat generation density, in particular to a method for preparing a cold plate with high corrosion resistance and complex flow channels. Background technique [0002] Due to the continuous development of microelectronic technologies such as Very Large Scale Integrated Circuits (VLSIC), Application Specific Integrated Circuits (ASICs), and Very High Speed ​​Integrated Circuits (VHSICs), modern electronic equipment is moving towards miniaturization, light weight, high operating frequency, high reliability and low cost. With the development of cost and other directions, the assembly density of microelectronic components and equipment has increased rapidly, and solid-state circuits, integrated circuits, and large-scale integrated circuit electronic equipment have begun to develop in the direction of small, ultra-small, and m...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of corrosion of the complex flow channel of the cold plate, improve the long-term reliability of the electronic equipment, and provide a cold plate with a simple and compact structure, high high temperature resistance, high reliability, high corrosion resistance and high temperature resistance, and its flow channel. Tao preparation method

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