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Apparatus and method for treating substrate

A substrate and equipment technology, applied in the field of equipment for drying substrates, can solve problems such as a large amount of time, time consumption, and deterioration of process efficiency

Active Publication Date: 2018-01-19
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the supercritical fluid is supplied at a low flow rate in the initial supply stage, it takes a lot of time to sufficiently fill the supercritical fluid into the chamber
Therefore, unnecessary time is consumed in the preparation process for handling the substrate
In addition, the process efficiency deteriorates due to the delay in the time for drying the substrate

Method used

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  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate

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Embodiment Construction

[0041] Hereinafter, exemplary embodiments of the present inventive concept will be described in more detail with reference to the accompanying drawings. The embodiments of the inventive concept can be modified in various forms, and the scope of the inventive concept should not be construed as being limited to the following embodiments. The embodiments of the inventive concept are provided to more fully describe the inventive concept to those skilled in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize a clearer description of these components.

[0042] Hereinafter, the substrate processing apparatus 100 (see figure 2 ) for description.

[0043] The substrate processing apparatus 100 may perform a supercritical process of substrate processing by using a supercritical fluid as a process fluid.

[0044] Here, the substrate is an inclusive concept including a semiconductor device or a flat panel display (FPD), and other substrates used t...

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Abstract

A method for treating a substrate, in which a supercritical fluid is supplied into a chamber, in which the substrate is carried, to treat the substrate, the method including a supply step of supplyingthe supercritical fluid into the chamber until a pressure of the interior of the chamber reaches a preset pressure, and a substrate treating step of performing a supercritical process while repeatingsupply and exhaust of the supercritical fluid into and out of the interior of the chamber after the supply step, wherein a flow rate of the supercritical fluid supplied into the chamber in the supplystep is variable.

Description

technical field [0001] The inventive concept relates to an apparatus and method for processing a substrate, and more particularly, to an apparatus and method for drying a substrate. Background technique [0002] Generally, a semiconductor device is formed on a substrate such as a silicon wafer through various processes such as a photolithography process, an etching process, an ion implantation process, and a deposition process. [0003] Furthermore, in the above process, various foreign substances such as particles, organic pollutants, and metal impurities are generated. Since foreign matter causes defects and directly affects the performance and yield of semiconductor devices, the semiconductor manufacturing process is essentially accompanied by a cleaning process for removing foreign matter. [0004] The cleaning process includes a chemical treatment process that uses chemicals to remove contaminants from the substrate, a wet cleaning process that uses pure water to remov...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCF26B21/14B08B7/0021F26B21/10H01L21/02101H01L21/02052H01L21/6704H01L21/67207H01L21/02307H01L21/02343F26B21/06H01L21/02046H01L21/30604H01L21/67017H01L21/67028H01L21/67034H01L21/67069
Inventor 李暎熏林义相赵珉晙李载明
Owner SEMES CO LTD