Manufacturing method of flexible OLED substrate

Abstract

The invention discloses a manufacturing method of a flexible OLED substrate. The manufacturing method comprises the following steps of S1, providing a supporting plate; S2, forming a flexible materiallayer on the supporting plate; S3, forming a barrier layer on the flexible material layer, wherein the barrier layer adopts a multi-layered structure, and comprises an inorganic layer and an organiclayer stacked mutually, wherein the inorganic layer is arranged on the surface on one side, far from the flexible material layer, of the barrier layer; the inorganic layer adopts the material of SiN<x> or SiO<x>N<y> with thickness of greater than 2,000-angstrom; and S4, manufacturing a layer of inorganic material to form a flat layer on the barrier layer through a bias sputtering method, removingconcave and convex points from the surface of the whole flexible material layer to realize an isoplanar structure. According to the manufacturing method, after the barrier layer is completely formed,the inorganic flat layer is manufactured by the bias sputtering method; and the tiny concave and convex points on the surface of the flexible material layer can be eliminated through etching and re-sputtering effects, so that electrode wiring smooth transition can be facilitated, post processing can be reduced, and the electrode wire breaking probability in device bending can be lowered.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a flexible OLED substrate. Background technique [0002] Flexible display technology has developed rapidly in recent years, and flexible display panels have made great progress in terms of screen size and display quality. Compared with traditional rigid OLEDs, the biggest feature of flexible OLEDs is that they can be bent and displayed. The realization method is to use flexible plastic substrates with thin-film packaging technology. The specific method is: first attach or grow a layer of flexible substrates such as PI or PET on the glass, Then make the barrier layer and electrode layer on the flexible substrate, and then complete the evaporation and film packaging after the wet process forms the pattern, and then the bending can be realized after the whole is removed. [0003] Obviously, the number of bending resistance is one of the most important co...

AI Technical Summary

Problems solved by technology

However, during the curing or molding process of flexible substrates such as PI or PET, concave and convex points are formed on the flexible substrate due to uneven heat shrinkage. Concave-convex points formed on the substrate

After the concave-convex points are formed on the flexible substrate, it is impossible to fill these concave-convex points when using the PECVD method as a barrier layer on the flexible substrate, resulting in a sharp inflection point in the electrode wiring. When performing a bending test with a small radius of curvature, the electrode is prone to Stress Discontinuity Occurs Fracture

[0004] In order to solve the above problems, a flat layer is often made. The commonly used flattening material is acrylic resin, which has a low glass transition temperature (generally less than 150°C) and a high thermal expansion coefficient (greater than 60ppm / K), making it difficult to achieve flexibility. Industrialization of OLED