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Treatment system

A processing system and processing chamber technology, applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problems of equipment cost increase and achieve the effect of reducing the occupied area

Active Publication Date: 2018-01-19
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, a larger clean room is required and the equipment cost increases

Method used

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Embodiment Construction

[0019] In one embodiment, the disclosed processing system includes one or more processing units. Each processing unit has a plurality of processing chambers and common modules. Each processing chamber processes an object to be processed using the supplied processing gas. The common module includes a flow control unit that controls the flow rates of processing gases supplied to the plurality of processing chambers. A plurality of processing chambers are arranged to overlap in the vertical direction. The common module is disposed between two adjacent processing chambers in the vertical direction among the plurality of processing chambers.

[0020] In addition, in one embodiment of the disclosed processing system, each processing unit may have a first pipe through which the processing gas distributed from the flow control unit to the plurality of processing chambers flows, and from the flow control unit to the respective processing chambers. The lengths of the first pipes of t...

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Abstract

This treatment system is provided with one or more treatment units (20). Each of the treatment units (20) has a plurality of treatment chambers (22), and a utility module (30). Each of the treatment chambers (22) treats, using a supplied treatment gas, a subject to be treated. The utility module (30) includes a flow rate control unit (31) that controls the flow rate of the treatment gas to be supplied to each of the treatment chambers (22). The treatment chambers (22) are disposed by overlapping each other in the vertical direction. The utility module (30) is disposed between two treatment chambers (22) adjacent to each other in the vertical direction, said two treatment chambers being among the treatment chambers (22).

Description

technical field [0001] Various aspects and embodiments of the invention relate to processing systems. Background technique [0002] In order to improve the productivity of substrate processing, a plurality of substrates to be processed may be processed in parallel using a plurality of substrate processing apparatuses. In this case, since a plurality of substrate processing apparatuses are arranged in facilities such as a clean room, the area occupied by the plurality of substrate processing apparatuses increases. Therefore, a larger clean room is required, and the equipment cost increases. In order to avoid this problem, it is conceivable to reduce the number of substrate processing apparatuses installed per unit area by arranging a plurality of substrate processing apparatuses vertically in multiple layers (see, for example, Patent Document 1 below). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCC23C16/4412C23C16/45561C23C16/50H01J37/32009H01J37/3244H01L21/67017H01L21/67173H01L21/67178H01L21/6719H01L21/67201H01L21/02C23C16/52H01J37/32357H01J37/32889H01J37/32899H01J2237/3321H01J2237/334H01L21/67063H01L21/67167H01L21/68707
Inventor 谷藤保汤浅珠树川上聪
Owner TOKYO ELECTRON LTD