Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin composition for photo-semiconductor, method for producing same, and photo-semiconductor device

A resin composition, optical semiconductor technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of large transmittance changes, lack of productivity, increased brightness changes, etc., to achieve excellent molding workability, sealing work Excellent performance and good productivity

Inactive Publication Date: 2020-05-08
KYOCERA CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the sealing method using a two-component type sealing material, it lacks the aforementioned productivity.
Correspondingly, in transfer molding and compression molding using a solid sealing material with high productivity, solidification occurs when the mixing / kneading time increases, so it is difficult to suppress the segregation of the colorant
[0006] In addition, although the above-mentioned segregation problem can be solved if an organic dye is used as a colorant, due to its lack of heat resistance, especially in the case of adding a small amount, the transmittance changes greatly after the heat history. In the case of sealing a light-emitting element with it, the change in luminance increases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for photo-semiconductor, method for producing same, and photo-semiconductor device
  • Resin composition for photo-semiconductor, method for producing same, and photo-semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] In order to obtain the compounding amount of the composition shown in Table 1, first, the above-mentioned pre-kneaded product (1), liquid bisphenol A epoxy resin ("YD-8125") at room temperature, bisphenol A type epoxy resin ("YD-8125") solid at room temperature, Phenol A type epoxy resin (produced by Mitsubishi Chemical Co., Ltd., trade name "Epikote 1002" ("Epikote 1002")), a trifunctional epoxy resin with a triazine skeleton in a solid state at room temperature (Nissan Chemical Industry Co., Ltd. ), product name "TEPIC-S"), liquid acid anhydride at room temperature (manufactured by Shin Nippon Chemical Co., Ltd., product name "RIKACID MH-700" ("RIKACID MH-700")), and di Butylated hydroxytoluene (BHT) is mixed at a temperature of 70°C by a universal mixer, and secondly, in the mixture, dimethyl tributylphosphonium phosphate (manufactured by Nippon Chemical Industry Co., Ltd.) is added as a curing accelerator , trade name "ヒシコーリン PX-4MP" ("HISHICOLINPX-4MP")), further k...

Embodiment 2～4

[0062] (Examples 2-4, Comparative Examples 1-4)

[0063] Except that the pre-kneaded product (2) was used instead of the pre-kneaded product (1), and the compounding amount was set so that the compounding amount of each component became the composition shown in Tables 1 and 2, it was the same as in Example 1. operation to obtain a resin composition for optical semiconductors.

Embodiment 5

[0065] Except having mixed carbon black and another component as it was without using the pre-kneaded product, it carried out similarly to Example 1, and obtained the resin composition for optical semiconductors of the composition similar to Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition for optical semiconductors that prevents the segregation of a colorant and secures a stable transmittance, and a method for producing the same, and a semiconductor device prepared with such a composition.SOLUTION: A resin composition for optical semiconductors contains (A) an epoxy resin containing a solid epoxy resin, (B) a liquid acid anhydride, (C) a curing accelerator, and (D) carbon black with an average primary particle size of 1 to 50 nm, with a content of the (D) carbon black being 0.01 to 0.05 mass% of the whole composition. There are also provided a method for producing the same, and an optical semiconductor device having a semiconductor element sealed by the composition.SELECTED DRAWING: None

Description

technical field [0001] This invention relates to the resin composition for optical semiconductors, its manufacturing method, and an optical semiconductor device. Background technique [0002] In optical semiconductor devices (optical devices) incorporating light-emitting elements such as light-emitting diodes and semiconductor lasers, transparent resin compositions with high transmittance have been used as sealing materials for light-emitting elements for the purpose of improving brightness. Generally used methods for sealing include dropping a liquid thermosetting resin under normal pressure or vacuum and pouring it into a box or mold containing parts and curing it (casting method). Methods based on transfer molding, compression molding. In the casting method, a so-called two-component sealing material is used, while in transfer molding and compression molding, a solid sealing material is used. From the viewpoint of productivity, the latter method is preferable. [0003]...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/04C08K5/13C08K5/521C08G59/42H01L33/56
Inventor 冈本正法
Owner KYOCERA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com