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Air guiding device for heat dissipation of server

An air guide device and server technology, which is applied in the fields of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as overheating, burning out motherboard components, affecting server performance, etc., to prevent confusion, improve The effect of cooling efficiency

Pending Publication Date: 2018-01-30
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the era of cloud computing, the performance requirements for servers are getting higher and higher. In order to meet customers' computing, processing and storage requirements for explosive information, more and more functional components are integrated and equipped in servers, and the server chassis is gradually getting larger. , the height of the traditional server chassis is gradually changing from 1U (U refers to the server height unit, 1U is equivalent to 44.5mm) to 2U and 4U. Due to the different functional positioning, some storage types of 2U and 4U servers are usually equipped with a large number of hard disk resources. , and the CPU (Central Processing Unit), DIMM (Dual In-line Memory Module) and other components are not very demanding, and the demand is not much. In the case of balancing performance and cost, a 1U-height motherboard will be used. However, this In this kind of assembly, the air volume of the system is more scattered in a large chassis space, and the air volume directly blown to the motherboard area is small, which often cannot meet the requirements of the CPU, DIMM, SWITCH (chip with signal conversion function), M.2 on the motherboard. (SSD interface) and other components are prone to overheating and overheating. In severe cases, it may even burn out the motherboard components and affect the performance of the server. If the system uses a fan with a larger air volume, it will not only bring power consumption and cost The increase is also a huge waste of resources

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  • Air guiding device for heat dissipation of server
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  • Air guiding device for heat dissipation of server

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Embodiment Construction

[0014] The present invention will be further described through the embodiments below in conjunction with the accompanying drawings.

[0015] The air guide device for heat dissipation of the server of the present invention is mainly used for heat dissipation of a small main board in a high chassis, and can guide the air volume in a 2U space to the main board area with a height of 1U, which can solve the problem that the components in the main board area need a large amount of air to take away themselves It avoids the problem of a large amount of wind loss caused by the large space, and can improve the utilization efficiency of the fan.

[0016] like Figure 1 to Figure 3 As shown, the air guide device for heat dissipation of the server of the present invention includes an air inlet end 4 , an air outlet end 5 , a side plate 2 , a top plate 1 , a slanted cover plate 8 and ribs 3 . Among them, the air inlet end 4 is opposite to the fan 11 in the chassis. In order to be able to c...

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Abstract

The invention relates to an air guiding device for heat dissipation of a server, and belongs to the technical field of cloud computing data centers. The air guiding device comprises an air inlet end and an air outlet end, the width of the air inlet end is larger than that of the air outlet end, the air inlet end is connected with an inclined cover plate, the low end of the inclined cover plate isconnected with a top plate, the top plate is connected with the air outlet end, a fin is arranged on the lower portion of the air inlet end and comprises a high-level section, a slope section and a low-level section, the high-level section is positioned on the lower portion of the air inlet end, the slope section is positioned on the lower portion of the inclined cover plate, the low-level sectionis positioned on the lower portion of the top plate, a CPU (central processing unit) air duct is formed between the fin and a left side plate, and a DIMM (dual in-line memory module) air duct is formed between the fin and a right side plate. The air guiding device has the advantages that an independent air guiding channel is built, internal heat source mixing is avoided, more system cold air canbe guided to a rear heating element, the air guiding channel can guide more air blown to a large space by a fan to a heating element of a main board in a small space in a centralized manner, and the heat dissipation efficiency of the main board can be improved.

Description

technical field [0001] The invention relates to an air guide device for heat dissipation of a server, belongs to the technical field of cloud computing data centers, and is especially suitable for heat dissipation of a 1U-height main board in a 2U-height chassis. Background technique [0002] In the era of cloud computing, the performance requirements for servers are getting higher and higher. In order to meet customers' computing, processing and storage requirements for explosive information, more and more functional components are integrated and equipped in servers, and the server chassis is gradually getting larger. , the height of the traditional server chassis is gradually changing from 1U (U refers to the server height unit, 1U is equivalent to 44.5mm) to 2U and 4U. Due to the different functional positioning, some storage types of 2U and 4U servers are usually equipped with a large number of hard disk resources. , and the CPU (Central Processing Unit), DIMM (Dual In-l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 周立志
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD