Fingerprint recognition module structure, manufacturing method and terminal equipment

A fingerprint recognition module and fingerprint recognition technology, which are used in character and pattern recognition, acquisition/organization of fingerprints/palmprints, semiconductor/solid-state device manufacturing, etc. , reduce the unlocking success rate and other issues, to achieve the effect of improving imaging quality, increasing the screen area ratio, increasing the unlocking success rate and screen area ratio

Pending Publication Date: 2018-02-09
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there are problems in the fingerprint identification method in the prior art
Setting the fingerprint recognition method on the back of the phone will increase the time to unlock the fingerprint, and the user experience is not good
In the front cover mode, if the cover glass is too thick, it will affect the fingerprint recognition signal and reduce the success rate of unlocking; when the cover glass is digging blind holes, the process yield is low and the screen is fragile; The integrated display module in the recognition area cannot further increase the screen area ratio

Method used

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  • Fingerprint recognition module structure, manufacturing method and terminal equipment
  • Fingerprint recognition module structure, manufacturing method and terminal equipment
  • Fingerprint recognition module structure, manufacturing method and terminal equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Figure 1A A schematic diagram of the structure of a fingerprint identification chip provided by Embodiment 1 of the present invention; Figure 1B A schematic diagram of another fingerprint identification chip structure provided by Embodiment 1 of the present invention; Figure 1C A schematic diagram of the structure of a fingerprint identification module provided by Embodiment 1 of the present invention; Figure 1D It is a schematic diagram of another fingerprint recognition module structure provided by Embodiment 1 of the present invention. The fingerprint recognition module in the embodiment of the present invention is preferably a fingerprint recognition module in a full-screen mobile phone, and this technical solution can also be applied to a display screen of an electronic device such as a tablet or a computer.

[0041] Such as Figure 1A As shown, the fingerprint recognition chip structure includes a fingerprint recognition chip 104 , a filter layer 101 and a pa...

Embodiment 2

[0057] Figure 2A It is a top structural block diagram of a terminal device provided in Embodiment 2 of the present invention. Figure 2B It is a schematic cross-sectional structural diagram of a terminal device provided by Embodiment 2 of the present invention. Figure 2C It is a schematic cross-sectional structural diagram of another terminal device provided in Embodiment 2 of the present invention. Such as Figure 2A As shown, the terminal device 20 includes the fingerprint recognition module structure 10 provided in Embodiment 1 of the present invention.

[0058] Wherein, the terminal device 20 may be an electronic terminal device such as a mobile phone, a tablet, or a computer that can have a fingerprint recognition function.

[0059] Optionally, the terminal device 20 further includes a display screen 30 , and the fingerprint identification module 10 is attached below the display screen 30 .

[0060] Exemplarily, the embodiment of the present invention is described b...

Embodiment 3

[0064] image 3 It is a schematic flowchart of a manufacturing method of a fingerprint recognition module structure provided by Embodiment 3 of the present invention. Figures 4A-4O It is a schematic diagram of a process flow of a manufacturing method of a fingerprint recognition module structure provided by Embodiment 3 of the present invention. This method can be used to prepare any fingerprint identification module structure provided in the above embodiments. It should be noted that the manufacturing method of the fingerprint identification module structure in the embodiment of the present invention is to prepare on the fingerprint wafer, and after the fingerprint identification chip structure is manufactured, it is divided into individual chips and bonded to the flexible circuit board. . The drawings provided in the embodiments of the present invention use a single fingerprint identification chip as an illustration, but in the manufacturing process, the entire fingerprin...

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PUM

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Abstract

The embodiment of the invention discloses a fingerprint recognition module structure, a manufacturing method and terminal equipment. The fingerprint recognition module structure comprises a fingerprint recognition chip, a filter layer and a patterned rewiring layer, wherein the fingerprint recognition chip is provided with a first surface and a second surface opposite to the first surface; the filter layer is positioned above an induction area of the first surface of the fingerprint recognition chip; a silicon through hole is formed in the second surface of the fingerprint recognition chip, and the silicon through hole is exposed out of a wafer bonding pad positioned on the first surface; and the patterned rewiring layer is arranged on the second surface and extends into the silicon through hole so as to be electrically connected with the wafer bonding pad. Through the adoption of the technical scheme, a screen display effect cannot be influenced while fingerprint unlocking is realized, the thickness of the fingerprint recognition chip is reduced, and the unlocking success rate and screen area proportion are improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductor device manufacturing, and in particular to a fingerprint recognition module structure and manufacturing method, and terminal equipment. Background technique [0002] Fingerprint recognition is currently a main method of identity authentication, and it is widely used in security, smart attendance, especially mobile phones and other fields. [0003] At present, fingerprint recognition has become the basic configuration of mobile phones. At present, fingerprint recognition solutions are mainly divided into two solutions: Coating (coating) on ​​the back of the mobile phone and front cover. The fingerprint recognition area is set on the back of the mobile phone or the lower area of ​​the mobile phone screen. The back fingerprint recognition adopts the push-type fingerprint recognition technology, which requires the finger to be pressed flat on the device so that the recognizer can obt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L23/31H01L23/488H01L23/528G06K9/00
CPCH01L23/528H01L21/50H01L23/31H01L23/488G06V40/12H01L2224/11
Inventor 吕军王邦旭赖芳奇李永智
Owner 苏州科阳半导体有限公司
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