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PCB dismounting equipment and method

A PCB board and equipment technology, which is applied in the field of PCB board removal equipment, can solve the problems of not being able to keep the device and the PCB board separated, the PAD on the PCB board falling off, and the heat not covering all the pins, etc., to achieve simple structure, convenient disassembly, The effect that usage is simple

Active Publication Date: 2018-02-16
GUANGXUN SCI & TECH WUHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is okay for temperature-insensitive and small-volume devices, but for butterfly-shaped devices with high temperature requirements and large volume, the heat often cannot cover all pins, and the force cannot be balanced when lifted up, causing the device to Pin deformation or PAD falling off on PCB board
In addition, because the device is large and heavy, simple tweezers or hand clamping cannot keep the device and the PCB board separated smoothly, and the device pins and the PAD on the PCB board are often connected together by solder, so they cannot be well connected. For the purpose of dismantling and repairing

Method used

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  • PCB dismounting equipment and method
  • PCB dismounting equipment and method

Examples

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Embodiment 1

[0040] Such as figure 1 As shown, a kind of PCB board dismantling equipment of the present invention comprises the PCB fixing support structure 2 for supporting and positioning the PCB board, the device positioning support structure 3 for supporting and positioning the butterfly device on the PCB board, The heating block 4 used to heat the pins around the butterfly device on the PCB, the mechanical structure used to drive the heating block 4 to move up and down, and the heating temperature control system 10 used to heat the heating block 4 and keep the temperature stable.

[0041] Such as figure 1 As shown, it also includes a stage 1 for placing a PCB fixed support structure 2 , a device positioning support structure 3 , a mechanical structure that drives the heating block 4 to move up and down, and a heating temperature control system 10 .

[0042] figure 2 It is a PCB board of a butterfly device to be disassembled provided by an embodiment of the present invention, such a...

Embodiment 2

[0050] This embodiment is a method embodiment, and belongs to the same technical concept as the above-mentioned embodiment 1. Please refer to the above-mentioned embodiment 1 for the content not described in detail in this embodiment.

[0051] A kind of dismantling method of the PCB board dismantling equipment that adopts above-mentioned butterfly device of the present invention, concrete operation steps are as follows:

[0052] Step 1. Open figure 1 The movement rod positioning structure 7 in the middle, the heating block 4 is lifted to the highest position by moving the handle 6 up and down, and then the movement rod positioning structure 7 is locked, and the heating block 4 remains still;

[0053] Step 2. Unscrew figure 2 The four fixing screws fixing the butterfly device on the back of the PCB board to be removed;

[0054] Step 3. If image 3 As shown, the PCB board is placed on the PCB fixed support structure 2 of the stage 1, and the top column of the device position...

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Abstract

The invention relates to the technology of dismounting and repairing of butterfly devices in the electronic and photo-communication industry and provides PCB dismounting equipment and method. The PCBdismounting equipment comprises a PCB fixing and supporting structure used for supporting and positioning a PCB, a device positioning and supporting structure used for supporting and positioning a butterfly device on the PCB, a heating block used for heating pins on the periphery of the butterfly device on the PCB, a mechanical structure used for driving the heating block to move up and down, anda heating and temperature controlling system used for heating the heating block and keeping the temperature stability. By means of the dismounting equipment and method, the invalid butterfly device welded to the PCB can be rapidly separated from the PCB without losses, the reutilization rate of the PCB or the butterfly device is effectively increased, and scraping, caused by partial small problems, of the whole PCB is avoided. The whole dismounting equipment is simple in composition, the manufacturing cost is low, operation and application is easy and flexible, and the PCB dismounting equipment and method are suitable for small-batch repairing application in the electronic or photo-communication industry.

Description

technical field [0001] The invention relates to the technical field of disassembly and repair of butterfly devices in the electronics and optical communication industries, in particular to a PCB board disassembly device and method. Background technique [0002] In the electronic or optoelectronic communication industry, this situation is often encountered: on a PCB board, the entire board cannot work normally due to the failure of a single device or component. If the PCB board and the device can be separated intact On the one hand, the remaining PCB boards can be effectively used, which improves the yield of the system and helps us save a lot of reprocessing time. On the other hand, the non-destructive disassembled device can be returned to the device manufacturer to analyze the cause of failure, which can better help improve the process. [0003] The technology of disassembling and repairing PCB boards has been widely used in the microelectronics industry for a long time. ...

Claims

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Application Information

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IPC IPC(8): B23K1/018B23K3/08
CPCB23K1/018B23K3/08B23K3/087
Inventor 丁兰童超张博
Owner GUANGXUN SCI & TECH WUHAN
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