Novel computer cooling device

Abstract

The invention discloses a novel computer cooling device which comprises a shell, wherein mounting seats are arranged on upper and lower sides of the shell; a dustproof net is arranged at the right endof the shell; a filter layer is arranged on the left side of the dustproof net; a fan bracket is arranged on the left side of the filter layer; a fan rotating shaft is arranged in the middle of the fan bracket; a plurality of fan blades are arranged in the middle of the fan rotating shaft; and a dehydrating unit is arranged on the left side of the fan bracket. The device is capable of fully removing dust and other impurities in air. In addition, the dustproof net is capable of effectively preventing sundries of a large size from entering the filter layer, and the filtering efficiency is improved. The dehydrating unit can fully absorb moisture in the air subjected to dust removal and filtration, and the moisture is prevented from being condensed into water drops inside the case so as not to damage electronic components; a cooling pipeline is of a spiral structure, so that the air refrigerating efficiency is greatly improved, and the computer cooling effect is improved; and the novel computer cooling device is simple in overall design and structure and convenient to use, the thought that the traditional components independently dissipate heat is changed, and the cooling effect and cooling efficiency are improved by reducing the overall ambient temperature in the case by cold air.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a novel computer heat dissipation device, which belongs to the field of computer heat dissipation. Background technique [0002] High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. [0003] Integrated circuits are heavily used in computer components. As we all know, the heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in ...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of complex structure and low heat dissipation efficiency of existing computer heat sinks, and provide a new type of computer heat dissipation device, which uses a filter layer to fully remove impurities such as dust in the air. Effectively intercept larger debris from entering the filter layer to improve filtration efficiency; the dehumidification device can fully absorb the moisture in the air after dust remov

Images