Polishing composition

A technology of composition and abrasive grains, which is applied to polishing compositions containing abrasives, grinding machine tools, grinding devices, etc., can solve the problems of easy sedimentation of abrasive grains, uneven grinding composition, grinding damage, etc., which is not easy to achieve Sedimentation, easy redispersion effect

Inactive Publication Date: 2018-02-23
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, since the abrasive grains in the polishing composition tend to settle, there is a possibility that the abrasive grains will settle during the transportation of the liquid and the polishing composition will become uneven (for example, see Patent Documents 1 to 5).
If the portion with low abrasive grain content in the polishing composition that has become uneven due to the sedimentation of abrasive grains is supplied to the polishing, there is a possibility that the polishing speed will decrease.
In addition, since the abrasive grains that have settled and aggregated are difficult to disperse again, if the polishing composition containing the aggregated abrasive grains is supplied to the grinding, there is a possibility that grinding damage will occur on the polished surface of the object to be polished.
Resin grinding objects are especially prone to grinding damage

Method used

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Embodiment Construction

[0018] Embodiments of the present invention will be described in detail. The polishing composition of this embodiment contains abrasive grains, a liquid medium, metal oxide particles, and a water-soluble polymer. In addition, the average primary particle diameter of the metal oxide particles is 1 / 10 or less of the average primary particle diameter of the abrasive grains, and the weight average molecular weight of the water-soluble polymer is 200 to 1000.

[0019] In the polishing composition having such a constitution, the abrasive grains are less prone to sedimentation, and the sedimented and aggregated abrasive grains are easily redispersed. Therefore, since the polishing composition is not easy to become uneven, and there are few aggregated abrasive grains, if the polishing object is polished using the polishing composition of the present embodiment, the polishing object can be polished at a high polishing rate. Grinding, and grinding damage is not easy to occur on the pol...

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Abstract

Provided is a polishing composition in which the abrasive grains are less likely to precipitate and the abrasive grains that have precipitated and agglomerated redisperse easily. The polishing composition contains abrasive grains, a liquid medium, metal oxide particles, and a water-soluble polymer. The average primary particle size of the metal oxide particles is 1 / 10 or less the average primary particle size of the abrasive grains, and the weight-average molecular weight of the water-soluble polymer is 200-1000.

Description

technical field [0001] The present invention relates to polishing compositions. Background technique [0002] When using a slurry-like polishing composition to polish, for example, a resin-made polishing object, it is necessary to transport the polishing composition from a storage container for the polishing composition to a polishing position of the polishing object through a pipe or the like. [0003] However, since the abrasive grains in the polishing composition tend to settle, there is a possibility that the abrasive grains will settle during liquid transfer and the polishing composition will become uneven (for example, see Patent Documents 1 to 5). If the portion of the polishing composition that has become uneven due to the sedimentation of the abrasive grains is supplied for polishing with a low abrasive grain content, the polishing speed may decrease. In addition, since the settled and aggregated abrasive grains are difficult to redisperse, if a polishing compositi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B37/00C09G1/02
CPCC09G1/02B24B49/14B24B27/0038B24B29/00C09K3/1463C09K3/1409B24B37/00C09K3/14C08L71/02
Inventor 镰田透森永均
Owner FUJIMI INCORPORATED
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