Anti-condensation heating device for intermediate frequency plasma power source

Abstract

The invention discloses an anti-condensation heating device for an intermediate frequency plasma power source. The device comprises a signal collection and control unit, a wireless communication module, a temperature and humidity sensor module, a temperature sensor module and a heating module, wherein the temperature and humidity sensor module is arranged for measuring the environment temperatureand humidity inside a case, and the temperature sensor module is arranged for measuring the temperature at a cooling water inlet; the temperature and humidity sensor module and the temperature sensormodule transmit collected data to the signal collection and control unit, the signal collection and control unit starts or closes the heating module by judging operation conditions; the signal collection and control unit uploads alarm information through the wireless communication module. The temperature and humidity are collected in real time by adopting a sensor, according to the condensation and relationship between the temperature and humidity, before the temperature and the humidity reach the saturated mode, the heating module is started, the condition that real-time temperature and humidity reach the condensation state is damaged, and therefore condensation is avoided.

Description

technical field [0001] The invention relates to the field of intermediate frequency plasma power supplies, in particular to an anti-condensation heating device for intermediate frequency plasma power supplies. Background technique [0002] At present, most of the intermediate frequency plasma power supplies use air cooling, water cooling, or a combination of the two to reduce the temperature in the chassis, so as to ensure that the various parts of the power supply work normally under a safe temperature range. Regardless of whether it is an air-cooled or water-cooled device, the purpose is to reduce the temperature in the chassis, but the humidity in the chassis is not considered while reducing the temperature. Especially when the water pipes of the cooling water are connected in series, because some power supplies are not powered on, there is no internal heating condition, but the cooling water is always circulating, resulting in very low internal temperatures of these powe...

AI Technical Summary

Problems solved by technology

Condensation at the chassis and insulating materials will reduce the insulation level of the chassis and insulating materials, and accidents such as creepage and flashover will easily occur

When condensation occurs on electronic devices, especially integrated circuit modules, it may cause the modules to expand with heat and contract with cold to burst, damage the devices, and cause huge losses to personnel or equipment

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