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Silicon wafer horizontal cleaning device

A technology for cleaning devices and silicon wafers, applied in cleaning methods and utensils, cleaning methods using tools, cleaning methods using liquids, etc. The effect of reducing pure water consumption and energy consumption, avoiding the use of chemical reagents, improving the degree of automation and cleaning efficiency

Active Publication Date: 2018-03-06
LONGI GREEN ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a silicon wafer horizontal cleaning device, which solves the problems of high consumption of pure water and chemical agents, large amount of waste water and low degree of automation in existing tank cleaning machines

Method used

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  • Silicon wafer horizontal cleaning device
  • Silicon wafer horizontal cleaning device
  • Silicon wafer horizontal cleaning device

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, a silicon wafer horizontal cleaning device provided in this embodiment includes a frame body 113 on which a brush mechanism, a spray mechanism, an ultrasonic mechanism and a drying mechanism are installed. The frame body 113 is also provided with a transmission mechanism that drives the silicon wafer to move horizontally. The transmission mechanism drives the silicon chip to complete the processes of brushing, spraying, ultrasonic cleaning and drying of the silicon chip on the frame body 113 .

[0026] According to the cleaning process sequence of silicon wafers, combined with the above-mentioned mechanisms to process silicon wafers, the concepts of "upstream" and "downstream" are introduced here to describe the spatial arrangement of each mechanism. Those skilled in the art can easily understand that the surface of the silicon wafer can be divided into a first surface and a second surface opposite to the first surface. If it is defined that ...

Embodiment 2

[0038] Such as figure 2 As shown, this embodiment provides a silicon wafer horizontal cleaning device. This embodiment is an improvement on Embodiment 1. The improvement is that the ultrasonic mechanism has multiple groups, and the first surface ultrasonic vibrating plates 108 of each group are connected as an integral structural member, and the second surface ultrasonic vibrating plates 109 of each group are connected as an integral structural member. Such setting enables continuous ultrasonic cleaning of silicon wafers during the ultrasonic cleaning process, further improving the effect of silicon wafer cleaning.

Embodiment 3

[0040] Such as image 3 As shown, the silicon wafer horizontal cleaning device provided in this embodiment is an improvement on Embodiment 1. Its improvement is that the first surface brush 104 and the second surface brush 103 are two, and a first surface brush 104 and a second surface brush 103 are arranged upstream of the ultrasonic mechanism. A first surface brush 304 and a second surface brush 303 are arranged downstream.

[0041] The ultrasonic mechanism includes two sets of ultrasonic vibrating plates, the first surface ultrasonic vibrating plates 108 are arranged at intervals, and the second surface ultrasonic vibrating plates 109 are arranged at intervals. A set of water squeezing rollers 107 is set between the ultrasonic mechanism and the first surface brush 104 downstream, and a set of water squeezing rollers 107 is also set on the upstream second surface brush 103 .

[0042] Such as image 3 As shown, the same side of the first surface brush 104 downstream of the...

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Abstract

The invention discloses a silicon wafer horizontal cleaning device. The silicon wafer horizontal cleaning device comprises a transmission mechanism, a hairbrush mechanism, an ultrasonic mechanism, a spraying mechanism and a drying mechanism. The transmission mechanism is provided with an upstream for importing a silicon wafer and a downstream for outputting the silicon wafer; the hairbrush mechanism, the ultrasonic mechanism and the spraying mechanism are arranged between the upstream and the downstream of the transmission mechanism; the drying mechanism is arranged on the downstream of the transmission mechanism, the hairbrush mechanism is used for scrubbing the surface of the silicon wafer, the ultrasonic mechanism is used for cleaning the silicon wafer ultrasonically, the spraying mechanism is used for spraying cleaning solution to the rinsed or ultrasonically cleaned silicon wafer, and the drying mechanism is used for drying the silicon wafer treated by the hairbrush mechanism, theultrasonic mechanism and the spraying mechanism. The silicon wafer horizontal cleaning device is assisted with mechanical and physical actions of ultrasonic waves and spraying in the horizontal scrubbing process, so that use of chemical reagents is reduced or even avoided, and meanwhile, the consumption of pure water and energy consumption are reduced, and the silicon wafer cleaning degree of automation and the cleaning efficiency are improved.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer cleaning equipment, and in particular relates to a silicon wafer horizontal cleaning device. Background technique [0002] With the continuous development of the world economy, the demand for high-efficiency energy in modernization is increasing. Photovoltaic power generation, as one of the main energy sources for green energy and sustainable development of human beings, has been increasingly valued and developed vigorously by countries all over the world. Monocrystalline silicon wafers and polycrystalline silicon wafers, as the basic materials of solar cells for photovoltaic power generation, have extensive market demand. [0003] During the processing of solar cells, in order to ensure a high degree of cleanliness on the surface of silicon wafers, a large amount of cleaning fluid is required to be washed and combined with chemical and physical actions such as chemical corrosion, ultrasoni...

Claims

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Application Information

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IPC IPC(8): B08B1/04B08B1/02B08B3/02B08B3/12H01L31/18
CPCH01L31/1804B08B3/022B08B3/123B08B1/12B08B1/20B08B1/32Y02P70/50
Inventor 郭江涛赵可武邓浩李定武
Owner LONGI GREEN ENERGY TECH CO LTD