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A method of sinking nickel and palladium gold in small-pitch pcb

A small spacing, nickel sinking technology, applied in metal material coating process, coating, liquid chemical plating and other directions, can solve the problems of gold infiltration, fat edge and so on, and achieve the effect of improving product quality

Active Publication Date: 2019-08-13
华宇华源电子科技(深圳)有限公司
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Problems solved by technology

[0006] The purpose of the present invention is to provide a nickel-palladium gold deposition method for small-pitch PCBs. The technical solution provided by the present invention solves the problems of gold penetration and fat edges in the normal process of depositing nickel-palladium gold in existing small-pitch PCBs. technical issues

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  • A method of sinking nickel and palladium gold in small-pitch pcb

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present invention are clearly and completely described below. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0018] Because the board with small pitch and small pads has gold infiltration and fat edges (enlarged lines or pads) during the normal nickel-palladium-gold deposition process, customers cannot use them.

[0019] This embodiment provides a method for depositing nickel and palladium gold on small-pitch PCBs, including the following steps: pickling, water washing, micro-etching, water washing, pre-soaking, activation, water washing, post-soaking, water washing, chemical nickel, water washing, chemical palladium, Water wash, chemical gold, w...

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Abstract

The invention relates to the technical field of methods for depositing nickel, palladium and gold, in particular to a method for depositing nickel, palladium and gold on a small-spacing PCB (printed circuit board). The method comprises the following steps: acid washing, water washing, micro-etching, water washing, pre-soaking, activation, water washing, post-soaking, water washing, chemical nickel, water washing, chemical palladium, water washing, chemical gold and water washing; in the process of activation, the activation temperature is 78+ / -3 DEG C and the activation time is 800+ / -10S; in the process of chemical nickel, the temperature of a chemical nickel tank is 63+ / -2 DEG C, and the service life of the chemical nickel tank is less than or equal to 2.5MTO; and in the process of chemical palladium, the temperature of a chemical palladium tank is 43+ / -3 DEG C, and the service life of the chemical palladium tank is less than or equal to 3MTO. The invention aims to provide a method for depositing nickel, palladium and gold on the small-spacing PCB, and solves the undesirable technical problems of gold permeation, fat edges and the like of a conventional small-spacing PCB in a normal process of depositing nickel, palladium and gold by adopting the technical scheme provided by the invention.

Description

technical field [0001] The invention relates to the technical field of nickel-palladium-gold deposition methods, in particular to a nickel-palladium-gold deposition method for small-pitch PCBs. Background technique [0002] Electroless nickel gold, also known as chemical nickel gold, immersion nickel gold or electroless nickel gold, replaces palladium on the surface of copper through chemical reaction and then electrolessly coats a layer of nickel-phosphorus alloy on the basis of palladium core, and then through the replacement The reaction coats the surface of the nickel with gold. [0003] For conventional nickel-palladium-gold products, the pads are generally more than 7mil, and the distance between PAD and PAD is more than 6mil. When products conforming to this design are immersed in nickel-palladium gold, there are basically no phenomenon of gold penetration, palladium ion residual conduction, and fat edges. , the product batch yield rate is above 99%; [0004] With t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/32C23C18/42C23C18/18
CPCC23C18/1635C23C18/1655C23C18/18C23C18/32C23C18/42
Inventor 高团芬尤云召廖军华
Owner 华宇华源电子科技(深圳)有限公司
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