Device for preventing backwash liquid from polluting wafer

A wafer and liquid technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as wafer contamination, and achieve the effects of low cost, simple structure, and improved cleanliness.

Active Publication Date: 2018-03-06
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The chemical liquid splashed on the nozzle or swing arm gradually accumulates into larger droplets, and drips onto the wafer in the subsequent process steps, causing contamination of the wafer

Method used

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  • Device for preventing backwash liquid from polluting wafer
  • Device for preventing backwash liquid from polluting wafer
  • Device for preventing backwash liquid from polluting wafer

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Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0020] Such as figure 1 As shown, the present invention includes a power source 1, a lifting connecting rod 2, a lifting CUP3, a gas protection ring 4, a swing arm 5, a nozzle 6, a wafer table 7 and a process chamber 8, the lifting CUP3, the swing arm 5, and the nozzle 6 and the film holder 7 are all located in the process chamber 8, the power source 1 is installed below the process chamber 8, which can be a cylinder or a motor; the output end of the power source 1 is connected with a lifting connecting rod 2, and can drive the lifting connecting rod 2 Complete the lifting action according to the process requirements. The nozzle 6 is installed on the swing arm 5 and swings back and forth with the swing arm 5 .

[0021] Lifting CUP3 is a circular structure with variable diameter, that is, the top is truncated cone and the bottom is cylindrical. The wafer car...

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PUM

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Abstract

The present invention belongs to the field of semiconductor industry wafer wet processing, and specially relates to a device for preventing backwash liquid from polluting a wafer. A lifting CUP, a swing arm, a nozzle and a wafer carrying table are located in a process cavity, a power source is installed below the process cavity, an output end of the power source is connected with the lifting CUP,the wafer carrying table is located at the internal portion of the lifting CUP, and the nozzle is installed on the swing arm to swing with the swing arm; a gas protection ring is installed at the topportion of the lifting CUP, a plurality of gas outlets are uniformly distributed at the circumference of the inner side of the gas protection ring, at least one gas inlet is arranged at the circumference of the outer side of the gas protection ring, the at least one gas inlet and the gas outlets are communicated through internal gas rings arranged in the gas protection ring, the at least one gas inlet communicates with a gas supply source, gas is ejected through the internal gas rings and the gas outlets, a gas protection layer is formed at the inner side of the gas protection ring, and backwash liquid is renewedly flown into the lifting CUP. The device for preventing backwash liquid from polluting a wafer can prevent the liquid from being subjected to backwash at the surface of the swingarm to form liquid drops, can avoid that the liquid drops drop to the surface of the wafer in subsequent process steps so that the wafer is prevented from being polluted.

Description

technical field [0001] The invention belongs to the field of wafer wet processing in the semiconductor industry, in particular to a device for preventing backsplash liquid from polluting the wafer. Background technique [0002] Currently, wafer wet processing equipment in the semiconductor industry involves the spraying of chemical liquids. The liquid sprayed by the nozzle onto the wafer is aggravated by backsplash as the pressure of the liquid increases. The chemical liquid splashed on the nozzle or swing arm gradually accumulates into larger droplets, and drips onto the wafer in subsequent process steps, causing contamination to the wafer. Therefore, a device that can prevent the liquid splashed back from the nozzle or the swing arm remaining in the previous process step from dripping onto the wafer surface in the subsequent process step to pollute the wafer is very desirable. Contents of the invention [0003] In order to prevent the liquid splashed back on the wafer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67023H01L21/67051
Inventor 郑云龙
Owner SHENYANG KINGSEMI CO LTD
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