Device for preventing backwash liquid from polluting wafer

Abstract

The present invention belongs to the field of semiconductor industry wafer wet processing, and specially relates to a device for preventing backwash liquid from polluting a wafer. A lifting CUP, a swing arm, a nozzle and a wafer carrying table are located in a process cavity, a power source is installed below the process cavity, an output end of the power source is connected with the lifting CUP,the wafer carrying table is located at the internal portion of the lifting CUP, and the nozzle is installed on the swing arm to swing with the swing arm; a gas protection ring is installed at the topportion of the lifting CUP, a plurality of gas outlets are uniformly distributed at the circumference of the inner side of the gas protection ring, at least one gas inlet is arranged at the circumference of the outer side of the gas protection ring, the at least one gas inlet and the gas outlets are communicated through internal gas rings arranged in the gas protection ring, the at least one gas inlet communicates with a gas supply source, gas is ejected through the internal gas rings and the gas outlets, a gas protection layer is formed at the inner side of the gas protection ring, and backwash liquid is renewedly flown into the lifting CUP. The device for preventing backwash liquid from polluting a wafer can prevent the liquid from being subjected to backwash at the surface of the swingarm to form liquid drops, can avoid that the liquid drops drop to the surface of the wafer in subsequent process steps so that the wafer is prevented from being polluted.

Description

technical field [0001] The invention belongs to the field of wafer wet processing in the semiconductor industry, in particular to a device for preventing backsplash liquid from polluting the wafer. Background technique [0002] Currently, wafer wet processing equipment in the semiconductor industry involves the spraying of chemical liquids. The liquid sprayed by the nozzle onto the wafer is aggravated by backsplash as the pressure of the liquid increases. The chemical liquid splashed on the nozzle or swing arm gradually accumulates into larger droplets, and drips onto the wafer in subsequent process steps, causing contamination to the wafer. Therefore, a device that can prevent the liquid splashed back from the nozzle or the swing arm remaining in the previous process step from dripping onto the wafer surface in the subsequent process step to pollute the wafer is very desirable. Contents of the invention [0003] In order to prevent the liquid splashed back on the wafer ...

AI Technical Summary

Problems solved by technology

The chemical liquid splashed on the nozzle or swing arm gradually accumulates into larger droplets, and drips onto the wafer in the subsequent process steps, causing contamination of the wafer

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