Tinned copper band manufacturing process

Abstract

The invention discloses a tinned copper band manufacturing process. The tinned copper band manufacturing process comprises the following steps of removing redundant copper powder from the outer surface of a copper wire; performing washing on the outer surface of the copper wire by ethyl alcohol after copper powder is removed; performing wetting on the copper wire through soldering flux after the copper wire is washed by ethyl alcohol; performing calendaring on the copper wire after the copper wire is wetted by the soldering flux, and enabling the cylindrical copper wire to be changed into a rectangular copper band through calendaring; performing annealing treatment on the copper band; and performing tin coating on the copper band after the copper band is subjected to annealing treatment. By virtue of the tinned copper band manufacturing process, the copper powder on the surface of the copper wire can be reduced, and the finished product rate and forming efficiency of the tinned copperband can be improved.

Description

technical field [0001] The invention relates to the technical field of photovoltaic accessories, in particular to a manufacturing process of a tinned copper strip. Background technique [0002] Tinned copper strip, also known as photovoltaic soldering strip, or tinned copper strip, sub-convergence strip, etc., is mainly used in the connection between photovoltaic module cells, and plays an important role in conducting electricity and gathering electricity. [0003] Tinned copper strip is an important raw material in the welding process of photovoltaic modules. The quality of tinned copper strip will directly affect the current collection efficiency of photovoltaic modules and greatly affect the power of photovoltaic modules. [0004] At present, during the forming process of the tinned copper strip, the copper wire or the copper powder on the outer surface of the copper strip may easily cause pinhole defects in the tinned copper strip, or even serious quality defects of expo...

AI Technical Summary

Problems solved by technology

[0004] At present, during the forming process of tinned copper strip, due to the copper wire or the copper powder on the outer surface of the copper strip, it is easy to cause pinhole defects in the tinned copper strip, or even serious quality defects of exposed copper, resulting in an increase in the defective rate

It is also possible that due to the existence of copper powder, more tin slag will appear in the subsequent tin plating process, which needs to be removed from time to time, which also affects the forming efficiency of the tinned copper strip.

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