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Thermal shield for electrostatic chuck

An electrostatic chuck and heat shielding technology, applied in the direction of holding devices, circuits, and electrical components that apply electrostatic attraction, and can solve problems such as contact deformation, material fatigue, cracking, etc.

Active Publication Date: 2018-03-16
VARIAN SEMICON EQUIP ASSOC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to deformation of the metal heat shield and possible contacts between the metal heat shield and the chuck or the metal heat shield and the substrate
Since the chuck is usually made of ceramic material this can lead to thermal stress to the chuck which can lead to material fatigue or cracking

Method used

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  • Thermal shield for electrostatic chuck
  • Thermal shield for electrostatic chuck
  • Thermal shield for electrostatic chuck

Examples

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Embodiment Construction

[0016] As described above, in many applications it may be advantageous to heat the substrate while it is clamped onto the electrostatic chuck. Traditionally, this heating is performed using conduction, where the heat contained in the electrostatic chuck is transferred to the substrate, often using a backside gas.

[0017] As described above, there can be a large temperature differential between the electrostatic chuck in which the substrate is seated and the base providing the electrical and fluid connections to the electrostatic chuck. In some embodiments, this problem is addressed by separating the heated chuck from the substrate by a large distance such that a temperature gradient exists between the two components. However, in some embodiments, there may not be room to provide sufficient separation. For example, in some embodiments, the space between the chuck and the substrate may be 1 / 8" or less. In these embodiments, the resulting temperature gradient may adversely affe...

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Abstract

A thermal shield is disclosed that may be disposed between a heated electrostatic chuck and a base. The thermal shield comprises a thermal insulator, such as a polyimide film, having a thickness of between 1 and 5 mils. The polyimide film is coated on one side with a layer of reflective material, such as aluminum. The layer of reflective material may be between 30 and 100 nanometers. The thermal shield is disposed such that the layer of reflective material is closer to the chuck. Because of the thinness of the layer of reflective material, the thermal shield does not retain a significant amount of heat. Further, the temperature of the thermal shield remains far below the glass transition temperature of the polyimide film.

Description

technical field [0001] Embodiments of the present invention relate to thermal shields for electrostatic chucks, and more particularly, thermal shields for insulating a heated electrostatic chuck from a substrate. Background technique [0002] The manufacture of semiconductor devices involves many discrete and complex processes. Semiconductor substrates typically undergo many processes during the manufacturing process. When processing a substrate, the substrate is typically clamped to a chuck. This clamping can be mechanical or electrostatic in nature. The electrostatic chuck traditionally consists of multiple layers. The top layer (also referred to as the top dielectric layer) contacts the substrate and is made of an electrically insulating or semiconducting material because it generates an electrostatic field that does not form a short circuit. To generate electrostatic forces, a plurality of electrodes may be disposed below the top dielectric layer. The plurality of e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67103H01L21/6833H01L21/02274H01L21/324H01L21/67098H01L21/6831H02N13/00G03F7/70708
Inventor 岱尔·K·史东大卫·J·奇普曼
Owner VARIAN SEMICON EQUIP ASSOC INC
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