Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
A technology for manufacturing devices and semiconductors, which is applied in the field of semiconductor manufacturing devices and can solve problems that require time and experience
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[0057] figure 1 It is a schematic plan view showing the chip mounter of the embodiment. figure 2 From figure 1 A diagram explaining the operation of the pickup head and placement head when viewed in the direction of the middle arrow A.
[0058] The die mounter 10 generally includes a bare chip supply unit 1, a pick-up unit 2, an intermediate stage unit 3, a placement unit 4, a transport unit 5, a substrate supply unit 6, a substrate carry-out unit 7, and a control device for monitoring and controlling the operations of each unit. 8.
[0059] First, the bare chip supply part 1 supplies the bare chip D mounted on the board|substrate P. As shown in FIG. The bare chip supply unit 1 has a wafer holding table 12 that holds a wafer 11 , and a push-up unit 13 indicated by a dotted line that pushes up the bare chip D from the wafer 11 . The bare chip supply unit 1 moves in the XY direction by a drive unit not shown, and moves the picked up bare chip D to the position of the push-u...
Deformed example 1
[0094] use Figure 12 , 13 The push-up unit of Modification 1 will be described. Figure 12 , 13 It is a sectional view for explaining the push-up unit of Modification 1.
[0095] The push-up unit 13A of Modification 1 is the same as the embodiment except that it has a structure in which the type switching unit can be tilted. The type switching unit 136A includes a disk-shaped base portion 136Aa and a rectangular-shaped convex portion 136Ab corresponding to the size of a bare chip. The type switching unit 136A is rotatable about the shaft 136Ac as a fulcrum, whereby the type switching unit 136A can be tilted.
[0096]The pickup operation performed by the push-up unit 13A of Modification 1 is the same as that of the embodiment except step S4 of the embodiment. In step S4 of modification 1, the control device 8 and Figure 10 The type switching unit 136 shown is the same, the type switching unit 136A is raised horizontally, and the tip of the pin 131 is pushed from the u...
Deformed example 2
[0098] use Figure 14 ~ Figure 17 The push-up means of Modification 2 will be described. Figures 14 to 17 It is a sectional view for explaining the push-up unit of Modification 2.
[0099] The push-up means of Modification 2 is the same as that of the embodiment except for the configuration of the type switching means. The type switching unit 136B includes a belt-shaped base portion 136Ba formed of a sheet, a rectangular convex portion 136Bb corresponding to the size of a bare chip, a first pulley 136Bd1 , and a second pulley 136Bd2 . The convex portion 136Bb is formed by changing the thickness of the strip-shaped sheet. It is a structure in which the base part 136Ba is rotated with tension by the first pulley 136Bd1 and the second pulley 136Bd2. The type switching unit 136B can be raised and lowered. In addition, the length direction of the type switching unit can be adjusted by the interval between the first pulley 136Bd1 and the second pulley 136Bd2. As the belt-shape...
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