Heat conduction structure and heating and evaporating assembly
A heat-conducting structure and component technology, applied in the direction of vacuum evaporation plating, ion implantation plating, metal material coating technology, etc., to achieve the effect of promoting the uniformity of the temperature field and reducing interference
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[0017] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0018] combine figure 1 As shown, the heat conduction structure in this embodiment can be used in the field of evaporation coating. The heat conduction structure 30 includes several heat conduction pipes 10, wherein each heat conduction pipe 10 is a tubular body with a hollow interior and an opening 11. The outer walls of the several heat conduction pipes 10 12 are bonded and fixed to each other to form a heat conduction structure 30 , and the radial cross-sectional shape of several heat pipes 10 bonded and fixed together is a grid shape. The heat pipe 10 is used to accommodate the material to ...
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