Plugs and Modular Semiconductor Processing Equipment

Abstract

The invention discloses a blocking part and modular semiconductor processing equipment. The blocking part comprises a fixing part and a blocking core, wherein the fixing part comprises a head portionand a rod portion formed by extending from one end of the head portion; the rod portion is provided with an accommodating hole formed by extending inwards from one end far away from the head portion;the blocking core comprises a blocking core rod and a blocking core head formed by extending from one end of the blocking core rod; the blocking core rod is accommodated in a detachable mode in the accommodating hole; and a size of the blocking core head is greater than that of the accommodating hole. The modular semiconductor processing equipment disclosed by the invention consists of a pluralityof modules, and has the advantages of simple structure, convenience and flexibility for assembling, easiness for replacement, convenience for repair and the like. In addition, the blocking part disclosed by the invention is formed by two groups of different materials, not only can keep a holding force for a communication port, but also can take sealing and blocking effects, further can avoid damage to the communication port, and meanwhile, is convenient to assemble and low in cost.

Description

【Technical field】 [0001] The invention relates to the field of semiconductor surface treatment, in particular to a modular semiconductor processing equipment and a blocking member for surface treatment of semiconductor wafers. 【Background technique】 [0002] At present, integrated circuits are gradually being applied to many fields, such as computers, communications, industrial control and consumer electronics. The manufacturing of integrated circuits has become a basic industry as important as steel. [0003] Wafers are the carriers used to produce integrated circuits. In actual production, the wafers that need to be prepared have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and processes such as Dry treatment process based on chemical vapor and plasma technology. Among them, the wet processing process is a relatively widely used met...

AI Technical Summary

Problems solved by technology

[0004] However, the existing equipment for preparing ultra-clean wafer surfaces generally has the following disadvantages: 1. The structure is very complicated, the volume is relatively large, and the cost is also high; 2. Once these equipment fails, troubleshooting generally requires stopping the production line Production affects output; 3. Once the installation is completed, it is not easy to adjust and change the function and position; 4. It is inconvenient to carry

However, after the bolt exits the communication port, the sealing ring is likely to stay in the communication port, which is not easy to take out and is inconvenient to use

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