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An optical sub-module and an optical module

An optical sub-module and optical multiplexing technology, applied in the field of optical communication, can solve the problems of difficult to achieve electrical isolation of transmitted signals and received signals, disadvantageous to high-speed signal transmission, etc.

Active Publication Date: 2019-11-05
HISENSE BROADBAND MULTIMEDIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the circuit board can achieve a short-distance electrical connection with the optoelectronic chip, it is difficult to achieve good electrical isolation between the transmitted signal and the received signal, which is not conducive to the transmission of high-speed signals

Method used

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  • An optical sub-module and an optical module
  • An optical sub-module and an optical module
  • An optical sub-module and an optical module

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] The optical sub-module is the main photoelectric unit in the optical module. Some optical sub-modules only have a laser chip to realize the function of light emission; some optical sub-modules only have a light detection chip to realize the function of light reception; some optical sub-modules have both a laser chip and a light detection chip to realize light emission And light receiving function. Among them, the optical sub-module having both a laser chip ...

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Abstract

The invention provides an optical sub-module and an optical module, and relates to the field of the optical communication. The provided optical sub-module comprises a housing, a first circuit board, asecond circuit board, a first photoelectric device and a second photoelectric device. The side wall of the housing is provided with an opening, the first photoelectric device and the second photoelectric device are positioned in the housing. The edge of the first circuit board passes through the opening and is stretched into the housing, and the edge of the first circuit board is provided with afirst welding area and a gap. The edge of the second circuit board passes through the opening and is stretched into the housing, and the edge of the second circuit board is provided with a second welding area. The projection of the first welding area on the second circuit board is not coincided with the second welding area. The second photoelectric device is connected with the second welding areathrough the gap in a routing mode. The first photoelectric device is connected with the first welding area in the routing mode. The different photoelectric devices are connected through the differentcircuit boards, and the gap is capable of preventing the first circuit board from shielding the second welding area.

Description

technical field [0001] The invention relates to the field of optical communication, in particular to an optical sub-module and an optical module. Background technique [0002] The optical module is mainly composed of a housing, a main circuit board and an optical sub-module. The housing is used to package the circuit board and the optical sub-module together. The main circuit board is provided with electrical chips such as driver chips and MCU. The optical sub-module is packaged with optical cores such as laser chips and / or photodetectors. The main circuit board It is electrically connected to the optical sub-module, the main circuit board is connected to an external host computer to realize power supply and electrical signal transmission, and the optical sub-module is connected to an optical transmission medium such as an external optical fiber to realize optical transmission. [0003] figure 1 A schematic structural diagram of an optical sub-module provided for the compa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4246G02B6/428
Inventor 张拥健
Owner HISENSE BROADBAND MULTIMEDIA TECH